IPC Packages Today's Hot Industry Findings


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Northbrook, Ill. — IPC — Association Connecting Electronics Industries has released three new documents highlighting the latest technology developments divulged at recent IPC international conferences.

In 2002 and 2003, speakers from around the world presented their findings on today's hot new technologies at the IPC International Conference on Flexible Circuits and Chip Scale Packaging and the two IPC/JEDEC International Conferences on Lead Free: Electronic Components and Assembly in Taipei, Taiwan, and San Jose, Calif., respectively. IPC has now collected these presentations, packaged the hard copy and CD-ROM versions into three separate kits, and added them to its Online Store.

LDFR1202-K, IPC/JEDEC International Conference on Lead Free: Electronic Components and Assembly (Taipei, December 2002) — Kit, and LDFR0403-K, IPC/JEDEC International Conference on Lead Free Electronic Components and Assembly (San Jose, April 2003) — Kit, are two separate collections of presentations emphasizing the challenges that U.S. and international manufacturers face in creating lead-free processes.

FLXCSP02-K, IPC International Conference on Flexible Circuits and Chip Scale Packaging — Kit, contains 21 presentations on combinations of flexible circuitry and chip scale packaging and the independent and critical parameters of these two technologies.

IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.

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