-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
DEK and PacTech Join Forces for High-volume Wafer Bumping Solution
June 13, 2003 |Estimated reading time: 1 minute
Flemington, N.J. and Santa Clara, Calif. — DEK and PacTech USA have formed a technology partnership that leverages the strengths of the two companies.
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
PacTech USA is a sales and service subsidiary of PacTech GmbH, the world's leading wafer bumping and packaging subcontractor using electroless nickel/gold under bump metallization (UBM) and a variety of solder bumping techniques. Founded in 1995 as a spin-off of the Fraunhofer Institute and the Technical University of Berlin, PacTech provides full turnkey bumping process solutions: equipment, process technology transfer, bumping chemistry and wafer-level bumping services.
The fully automated, wet-chemical electroless production process assisted by PacTech's PacLine 2000 concept, a mass production equipment with a throughput of 150 wafers/hour, creates a thin Ni/Au UBM layer on op of the wafer pad metallization at a significantly lower cost than electroplating. Wafer sizes range from 4" to 12" and pad metallization may be aluminum or copper. The electroless Ni/Au UBM process once combined with solder bumping techniques such as stencil printing, ball placement or as a tall UBM only meets the aggressive cost targets of smart card and smart label applications as well as the high reliability requirements of automotive microelectronic products and flip-chip-in-a-package applications such as CSP or wafer-level CSP.
DEK, the world's leading provider of advanced pre-placement manufacturing solutions, provides ultra-fine-pitch mass imaging technologies that work in conjunction with PacTech's wafer processing systems to create a low-cost, high-volume production process for wafer-level flip chip assembly. DEK's stencil printing platforms may be used to print solder paste patterns with a variety of solder alloys or, using DirEKt Ball Placement, to place solder balls on PacTech-processed wafers.
For more information on DEK, visit www.dek.com. For more information on PacTech USA, visit www.pactech-usa.com.