Ultrathin Dielectric Materials to Be 3M Topic at IPC Embedded Passives Conference

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Austin, Texas — A paper on the electrical performance and reliability advantages of using ultrathin (less than 25 µm) power-ground cores for distributed embedded capacitance will be presented at the IPC International Conference on Embedded Passives by Joel Peiffer, engineering specialist, 3M Organic Materials Technology Center.

"Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitor Layers" will be presented Wednesday, June 11. Test results from leading OEMs, printed circuit fabricators and industry consortia will be reviewed, including comparisons of ultrathin embedded capacitor materials to existing commercial embedded capacitor materials and discrete surface-mounted (SMT) components. Additionally, data will be presented which will give board designers an idea of how much discrete capacitance can be removed by the use of ultrathin, high-capacitance, power-ground cores in printed circuit boards.

3M is an active member of IPC — Association Connecting Electronics Industries and the Advanced Embedded Passives Technology (AEPT) Consortium.

3M Microinterconnect Systems provides custom, high-performance flexible circuits for today's demanding electronics applications, including ink-jet printers, hard disk drives, optoelectronics, liquid crystal displays, medical, bio-analytical, IC packaging and other fine-pitch interconnect applications.

3M is a $16 billion diversified technology company with leading positions in consumer and office; display and graphics; electronics and telecommunications; health care; industrial; safety, security and protection services; transportation and other businesses.



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