-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
News
December 31, 1969 |Estimated reading time: 5 minutes
Compiled By SMT Staff
2002 NEMI Roadmap Shows Opportunity
HERNDON, Va. — There are several areas of potential growth for the electronics industry, according to the 2002 roadmap of the National Electronics Manufacturing Initiative (NEMI).
Portable Products. The large and growing proportion of products here are either wireless communication devices or devices that incorporate wireless communication capability. The need for rapid introduction of complex, multifunctional new products has led to the development of functional, modular components, or system-in-package (SiP).
Environmental and Regulatory Concerns. Two directives in the final legislative stages in the EU — Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) and Waste from Electrical and Electronic Equipment (WEEE) — will govern the material content and end-of-life management of electronics products and must be implemented by 2006 and 2004.
To date, most efforts in North America have focused on developing processes and capabilities for lead elimination. Other issues include materials data tracking and end-of-life responsibilities.
Design Technologies. The 2002 roadmap identifies the following areas for which various design, test and modeling tools must be developed: DfX areas need greater attention; Co-design of mechanical, thermal, RF and electrical performance of the entire chip, package and system is a key cross-cutting need; and simulation tools are needed by 2005 for optoelectronics and nano-electronics.
Supply Chain Management. Online information portals represent the latest attempt to provide a single, personalized access point to all the information employees need to monitor and control the processes within their scope of responsibility.
Optoelectronics. This was a hot topic in the 2000 roadmap. However, long-haul broadband capacity was overbuilt to meet the expected demands of Internet traffic that was doubling every 100 days. As the cyberspace boom slowed to doubling once a year, the large investments telecommunications companies made in their infrastructures did not yield expected returns. Optoelectronics growth in the telecommunications industry over the next several years is most likely to occur in the next-generation SONET equipment market, modules for the enterprise market and associated optical components. Additionally, there are other applications in which optoelectronics are making inroads, such as automotive and fiber to the home (FTTH).
PCB Book-to-Bill Ratio
Book-to-Bill Continues Uphill Trend
NORTHBROOK, Ill. — The IPC PCB book-to-bill ratio for March was 1.04, meaning $104 worth of orders for new boards were received for every $100 billed (shipped). The ratio increased from the February level of 1.03. Sales billed (shipments) in March 2003 decreased 29.2 percent from March 2002, and orders booked decreased 25.7 percent from March 2002. Compared to 2002, bookings of PCBs are down 19.8 percent YTD, while shipments of PCBs are down 24.6 percent YTD.
March's book-to-bill level increased from February's numbers, while orders booked for March 2003 decreased 25.7 percent above the level in March 2002.
null
Universal Takes to the Road
BINGHAMTON, N.Y. — Universal Instruments Corp. announces a series of road show events to take place across the Americas this year. The corporation's objective is to get closer to its customers while delivering an intimate experience through personalized introduction of numerous new products and support initiatives.
The 2003 road show concept is designed to strengthen customer relationships and allow the company to present its new products, refined support infrastructure and corporate strategies one-on-one. The 2003 road show began at the end of April. However, following are venues and dates still to come:
- Binghamton, N.Y., July 17-18
- New England (venue TBA) in September
- Chicago in September
- Guadalajara, Mexico in October.
For more information or to register for an event, visit the company's Web site at www.uic.com/roadshow, contact the support office at (800) 432-2607 or e-mail universal@uic.com.
V.J. Technologies Acquires Teradyne's Manual X-ray, Rework Businesses
BOHEMIA, N.Y. — V.J. ElectroniX, a division of V.J. Technologies Inc., acquired Teradyne's manual X-ray inspection systems business, which is part of the former NIS business, as well as the SRT rework systems business.
The manual X-ray business offers manual and semiautomated X-ray inspection systems, while the SRT business manufactures semiautomated and automated rework stations suited for microBGA, CSP and flip chip component technologies. Teradyne acquired both units when the company merged with GenRad in 2001.
Current clients of NIS manual X-ray products and SRT rework products will be serviced and maintained by V.J. ElectroniX customer support operations, following a brief transition from Teradyne. Teradyne has retained the automated X-ray product line.
MEMS 'Driving' Innovation in Automotive Sector
SCOTTSDALE, Ariz. — Despite the considerable opportunity that the automotive sector offers for many different uses of MEMS technology, In-Stat/MDR reports that only a few devices to date have been integrated in high volume in a small number of applications. The slow rate of integration into automobiles, and the amount of time needed for the trickle-down effect to take place has meant that the potential for MEMS in this sector has barely been tapped. However, the research firm reports that numerous current niche-level applications now are reaching a higher volume threshold and, as a result, the number of MEMS per car will nearly double to an estimated 9.1 per vehicle in 2007, up from the average of 5.0 per vehicle in 2002.
In-Stat/MDR also found the following:
- The areas in which MEMS will play a key role in the next five years include electronic stability control and rollover systems, occupant detection, and tire pressure monitoring systems (TPMS).
- Two applications of note on the horizon are biometric sensors for comfort programs and keyless entry, and optical MEMS for heads-up and entertainment displays.
EMS News
New EMS Company Enters the Industry
METHUEN, Mass. — Electronics manufacturing industry veteran and ball grid array (BGA) specialist Rich Breault, whose previous enterprise NETCO Automation was known for its expertise in BGA services and prototype development, founded a new EMS company — Lightspeed Manufacturing Inc.
The company offers quick-turn BGA services including rework, reballing, inspection, ECOs and upgrades for BGA, CGA, microBGA and other similar component types. Additionally, to keep up with advanced technology trends, Lightspeed also offers optical fiber splicing and traditional EMS PCB assembly services. The company already has shipped its first product and has set up production in a new building with updated facilities and equipment.
Suntron Expands Northern Mexico Operations
PHOENIX — Suntron Corp., an integrated electronics manufacturing services (EMS) provider, expanded its Tijuana, Mexico, facility to include automated SMT production. The facility focuses on high-mix, complex EMS, specializing in quick turn assembly of printed circuit cards, cable and harnesses, and box build.
The Tijuana facility services various high-reliability commercial and aerospace applications, as well as medical and semiconductor capital equipment end-markets. With the expansion, the company now can produce double-sided SMT boards up to 0.010" pitch, BGA, with full test capabilities.
Suntron's president and CEO said that the company will continue investing in Mexico and other low-cost regions in order to increase customer value.
Elcoteq Acquires NPRC
IRVING, Texas — Elcoteq, a global provider and European EMS company for the communications technology industry, acquired NPRC Inc., a Dallas-based new product introduction (NPI) services company. NPRC, renamed Elcoteq, NPI Dallas, is known for its customer focus and high-quality NPI services for communications technology manufacturers.
The newly acquired company will retain 14 employees and its facility in Carrollton, Texas. Gary Tanel, president and founder of NPRC Inc., will continue in the position of manager for the new entity.