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Minneapolis — The Ninth Annual Pan Pacific Microelectronics Symposium (February 10 through 12, 2004, Turtle Bay Resort, Kahuku, Oahu, Hawaii) promotes international technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin.
Sponsored by the SMTA, the Pan Pacific Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems and assembly.
The Program Committee is seeking participants to present recent research results at the Symposium on any of the following topics:
- Business Issues — Economics and Cost Analysis, Manufacturing Strategies, Environmental Matters, Cross Cultural Management, and Roadmaps.
- Packaging — Chip Scale, Ball Grid Array, MCM/SiP, 3-D and Stacked Packages, Thermal Management, Display Drivers, Flip Chip, RF and Microwave.
- Interconnection— Advanced PWBs, Blind and Buried Vias, Co-Fired Ceramics, Flat Panel Displays, Thin and Thick Film Materials, Shaped Circuits, and Flex/Flex Rigid.
- Markets — Trends and Forecasts, Segmentation, Penetration Strategies, Technology Drivers, and Characterizations.
- Assembly — Component Placement, Materials and Processes, Direct Chip Attach, Automation Control, Test and Troubleshooting, Repair and Rework.
- Microsystems Technology — MEMS/MOEMS, Optoelectronics, Sensors, Actuators, DFX, and Partitioning Strategies.
Abstracts of 500 words should be submitted online by August 22, 2003 towww.smta.org/pan_pac/call_for_papers.cfm.
Full manuscripts for the conference proceedings are due November 21, 2003. Papers should be six to 10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations. For more information, visit www.smta.org.