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West Haven and Danbury, Conn. — Enthone Inc., a Cookson Electronics Co., will expand marketing and distribution of its ViaForm copper damascene electrochemical deposition processes through an exclusive licensing and joint-development agreement with ATMI Inc. Under terms of the strategic partnership, ATMI will gain exclusive worldwide rights to use, distribute and sell products and services related to copper electrochemical deposition (Cu ECD) including ViaForm materials that Enthone will continue to manufacture. Enthone ViaForm processes provide superior yield performance for the deposition of copper on semiconductor wafers, enhancing integration into the chemical-mechanical planarization (CMP) process to reduce product defects. Providing material-based products centered on the chemical vapor deposition process, ATMI offers a complete material lifecycle management program to improve process tool uptime through its "surround the semiconductor" manufacturing process.
ATMI provides specialty materials, and related equipment and services, to the worldwide semiconductor industry. For more information, visit www.atmi.com.Enthone Inc. is a business of Cookson Electronics PWB Materials & Chemistry. The company is a worldwide, leading supplier of high-performance specialty chemicals and coatings used in the electronics and surface finishing industries. For more information, visit www.cooksonelectronics.com.