SMTA Announces SMTA International Conference Special Events

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Minneapolis — Featuring SMT, flip chip, MEMS, chip scale, BGA, automotive, lead-free, process control and more, SMTA International (September 21 through 25, Donald Stephens Convention Center, Rosemont, Ill.) is dedicated to surface mount, advanced packaging and related technologies.

This year's program will feature many special events, including free programs each day, such as the following:

  • A presentation on Six Sigma will explain why it is the right roadmap to achieve breakthrough performance in these challenging times, and how following Six Sigma will help attendees become stronger, faster and more profitable companies.
  • The NEMI Roadmap covers 18 Technical Working Groups chapters grouped into five technology groups. NEMI also coordinates with numerous other roadmapping organizations to coordinate schedules and industry elements. This presentation will go into detail of what makes up the individual chapters and how the process works to culminate in a complete document.
  • Board Talk is an open, enjoyable forum intended to cut through the marketing hype, platitudes and incompetent, unscientific baloney regarding electronic assembly problems and related matters. The instructors are donating all proceeds from attendance to the SMTA Charles Hutchins Scholarship Fund. Audience participation is essential to this lively forum format.
  • Manufacturing Migrations to China is a half-day symposium on business and technology issues surrounding electronics manufacturers moving operations to China. Topics include Component Procurement and Distribution, Capital Equipment Production, and Business and Regulatory Climate Preparedness.
  • A presentation on Reducing Your Line Set Up Time will start with a review of basic setup and changeover concepts followed by real-life case studies from RadiSys, where the average changeover time is around 20 minutes (including first article inspection).
  • A panel discussion, Future SMT Practices, will feature short presentations by industry experts discussing pick-and-place, solder, printing, reflow, test/inspection, and rework, all with respect to lead-free materials, optoelectronics, MEMS, Bluetooth, integrated manufacturing, process control software and EMS activity in China. Audience participation is also encouraged in this diverse panel format.
  • Returning from previous years will be the ever-popular symposiums on Electronics Manufacturing Services (EMS) and Lead-free Soldering; as well as the Emerging Technologies Summit, where attendees will get a glimpse of what the future holds for SiP/3-D, MEMS and Wireless. The Emerging Technologies Summit will finish with a panel discussion providing participants an excellent opportunity to interact with experts.
  • The Opening Session will feature Status of the Technology, an informative overview of component, substrate and assembly issues, including Component Trends — A Review of IPC 7095 BGA Implementation, Substrate Trends and Issues-Surface Finish Comparison, Assembly Trends and Issues — Low Volume Assembly, and Solder Trends and Issues-Lead Free Soldering.
  • Led by conference chair Rob Rowland, RadiSys Corp., the highly regarded SMTA International Technical Advisory Committee is comprised of electronics manufacturing and packaging experts who represent all facets of the industry.

SMTA International is co-located with the Assembly Tech Expo (ATExpo) at the Donald Stephens Convention Center in Rosemont, Illinois (Conference: September 21 through 25; Exhibits: September 23 through 25).

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations. For more information on SMTA International, visit



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