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Newport to Present on Advanced Manufacturing Techniques for Flip Chip Devices at Electro 2003
April 29, 2003 |Estimated reading time: 1 minute
Irvine, Calif. -- Daniel F. Crowley, director of sales at Newport/MRSI, a Newport Corp. company, will present a technical paper entitled "Advanced Manufacturing Techniques for Flip Chip Devices" at the technical conference of Electro 2003, at the Bayside Exposition Center, Boston, Mass., June 10 through 11, 2003. Crowley's presentation will discuss the critical requirements of high volume flip chip die bonding. The paper presents an overview of products and technologies using flip chip packaging techniques today and in the future. It includes a discussion of both the technical and cost issues of flip chip packaging.A comparison of a variety of flip chip packages will be presented, including a comparison of I/O count and package size. The emphasis of the paper is the methodology of flip chip die bonding and explains the individual flip chip process steps with a detail description of the die bonding process from the initial point of picking the die through fluxing to the actual placement of the die. Critical aspects of the process such as work holder planarity and vision processing are discussed as the key to high yield, high volume production.Daniel Crowley is the director of sales at Newport/MRSI, A Newport Corp. Co., in North Billerica, Mass., and has more than 18 years of capital equipment sales and marketing experience in the semiconductor and electronic packaging market specializing in dispense and assembly. Crowley holds an MSIE from Purdue University and BSIE from Northeastern University.Newport Corp. is a leading global supplier of advanced technology products and systems to the semiconductor, communications, electronics and research markets. For more information, visit www.newport.com.