-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC Honors Best Paper at IPC Printed Circuits Expo 2003
April 22, 2003 |Estimated reading time: 3 minutes
Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries recognized the winner of this year's Best Paper in Conference award, as well as 32 individuals for their contribution to IPC and the electronics industry, at IPC Printed Circuits Expo 2003, held March 23 through 27, in Long Beach, Calif.
"High Speed Transmission Line Requirements -- Impact on Performance, PCB Layout, Fabrication and Reliability," authored by Ciena Corp.'s Subhash Pochareddy, Lavanya Gopalakrishnan and Rajat Srivastava, received this year's award.
In addition, IPC recognized "Improvements in Polymer Thick Film Resistor Technology," as an honorable mention. Troy Bachman, PolyMore Circuit Technologies L.P., and Gregory Dunn, John Savic, Remy Chelini and Tim Dean of Motorola Inc., co-authored this paper.
Ciena Corp.'s winning paper received $1,000 and a commemorative plaque from IPC.
In addition, Michael Carano, Electrochemicals Inc., received IPC's Outgoing Chairman Award on behalf of the printed circuit board and electronics manufacturing services industries, their suppliers and customers. Carano was recognized for his leadership and devoted service as Chairman of the IPC Suppliers Council Steering Committee from 2001 to 2003.
Rainer Thueringer, C.I.D.+, Fachhochschule Giessen-Friedberg University of Applied Sciences, was honored with the IPC President's Award for his work in completing the translation of the entire IPC PCB Designer Certification Program into German. This award is given to members who have exhibited ongoing leadership in IPC and have made significant contributions to the association and the electronics assembly industry.
IPC presented two Special Recognition Awards to individuals who have made a recent exceptional contribution to an IPC program. Brian Butler, Introbotics Corp., was awarded for his significant contributions to the IPC and CAT Inc.'s Printed Board Process Capability,Quality and Relative Reliability (PCQR2) Benchmark Database and for providing exceptional controlled impedance test data. Thomas Gardeski, E. I. du Pont de Nemours and Co., received an IPC Special Recognition Award for his numerous contributions to the Technical Program Committee, for chairing a technical paper session at IPC Printed Circuits Expo 2003 and for chairing the Technical Conference at the inaugural 2003 International Symposium on Flexible Circuits and Chip Scale Packaging.
IPC also presented 28 volunteers with Distinguished Committee Service Awards at IPC Printed Circuits Expo 2003. This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC program.
The following were recognized for their significant efforts in the build and release of IPC-D-356B, Bare Substrate Electrical Test Data Format:
- Duane Delfosse, ECT Test Services Div.
- Elke Fleck, Mania GmbH & Co.
- Gilbert Volpert, ATG Test Systems GmbH
- Ilan Angier, Frontline PCB Solutions
- Marcia Rogowsky, ECT Test Services Div.
- Bini Elhanan, Valor Computerized Systems
For their significant efforts in the release of IPC-2221A, Generic Standard on Printed Board Design, the following were also presented Distinguished Committee Service Awards:
- Don Dupriest, Lockheed Martin Missiles & Fire Control
- Randy Reed, Merix Corp.
- Werner Engelmaier, Engelmaier Associates L.C.
- Susan Mansilla, Robisan Laboratory
- Mike Green, Lockheed Martin Space & Strategic Missiles
- Lionel Fullwood, WKK Distribution Ltd.
- Ignatius Chong, Celestica International Inc.
- Chris Conklin, Lockheed Martin Corp.
The following six members were awarded for their significant efforts in the release of IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Boards:
- Don Dupriest, Lockheed Martin Missiles and Fire Control
- Gary M. Ferrari, CID+
- Michael G. Luke, CID, Raytheon Co.
- Frank Y. S. Bai, TPCA
- Lionel Fullwood, WKK Distribution Ltd.
- Samy Hanna, AT&S
In recognition of their strong support of IPC's Designers Council and contributions to the design community, the following were awarded IPC Distinguished Committee Service awards:
- Philip Mayo, Premier EDA Solutions Ltd.
- Paul Fleming, C.I.D., Mentor Graphics
- Richard P. Hartley, C.I.D., Hartley Enterprise
- Andrew Kowalewski, C.I.D.+, SyChip Inc.
- Alan Johnson, C.I.D.+, Premier EDA Solutions Ltd.
Finally, Akikazu Shibata, JPCA, received IPC's Distinguished Committee Service Award for his significant work toward the development of IPC-0040, Optoelectronic Assembly and Packaging Technology, and Michael Beauchesne was awarded for his efforts in the release of the ANSI-approved IPC-4202, Flexible Base Dielectrics for Use in Flexible Printed Circuitry; IPC-4203, Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films; and IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry.IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.