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Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries announces a call for participation in its 2003 Annual Meeting and Technical Conference, taking place September 28 through October 2, at the Minneapolis Convention Center in Minneapolis, Minn.
This year's conference, entitled "Exotic Interconnections and Advanced Process Capability," will cover several key technology topics, including:
- An examination of how statistical benchmarking can target specific barriers to yield improvement and increased capability,
- A review of how RF substrates can answer the call for wireless communications,
- An exploration of the ways embedded passive components offer reduced layer and via counts and improved reliability through the reduction of solder joints,
- An analysis of the latest reports on the ability of new immersion finishes to offer superior co-planarity and capability, and
- A breakdown of how multi-chip packaging, such as System-in-Package (SiP) and stacked/folded die CSP offers measurable real estate savings to meet the untamed need for smaller product.
IPC has several opportunities for involvement in the 2003 IPC Annual Meeting and Technical Conference. Those who participate in this year's conference will gain great visibility to many industry leaders who use the research and findings of conference proceedings when developing standards and guidelines.
Presently, IPC is seeking individuals who are interesting in leading and organizing a technical session of five to seven speakers to present on various areas of a common theme. The session leader will use their technical expertise and knowledge of relevant topics to select presentations that will best benefit the industry.
Proposals are also being solicited from individuals interested in teaching full- or half-day professional development courses on design, printed circuit board and electronic manufacturing processes and materials. Such proposals and course descriptions must be submitted by May 23, 2003, and a master copy of the course workbook must be received by July 31, 2003. An honorarium will be offered to all professional development instructors.
In addition, IPC is seeking papers in the following areas:
Materials and Technology
- Buried/Embedded Components
- 3-D Multi-Chip Packaging Advances
- Signal Integrity
- High Frequency Materials
- Exotic Substrates
- Electronic Manufacturing Services
- Laser Microvia Formation
- Laser Trimming of Embedded Passives
- Advances in Via Protection and Fill
- High Aspect Ratio Hole Plating
- Solderability and Surface Finishes
- Direct Chip Attach, CSP, and µBGA Assembly
- Advances in Benchmarking
- AOI/AXI Inspection
- Controlled Impedance Testing
- Solder Joint Testing
- Accelerated Test/Thermal Reliability
- Microvia Inspection
- Plating Reliability
Paper presentations should be 30 minutes in length, non-commercial in nature and focus on technology rather than a company's product. Previously published papers and papers deemed commercial by the Technical Program Committee are not acceptable.Abstracts that detail case histories, field data, new technologies/innovations or research and findings and summarize the problems and resolutions, methods used, results of experiments and benefits to the industry must be received by May 23, 2003. Each 200-300 word abstract should include a biography. If an abstract is selected, technical papers will be due on July 31, 2003.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,400 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.