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YESTech Launches at APEX 2003 with Advanced X-Ray and AOI Inspection Systems
March 31, 2003 |Estimated reading time: 1 minute
Anaheim, Calif. -- YESTech has made its official launch with the introduction of two advanced new products at APEX 2003, North America's largest exhibition and conference on electronics manufacturing and testing.
The YTX-3000 provides high resolution X-ray inspection for printed circuit boards (PCBs), components and assemblies, while the YTV-1000 offers high speed, automated optical inspection (AOI) for PCB assemblies. The YTV-1000 is an inline system that inspects for component presence/absence, correct part, position, solder and color. Featuring up to eight proprietary mega-pixel color cameras, the YTV-1000 offers exceptional clarity and precision. The YTV-1000 can inspect an 8 x 10" board in less than seven seconds. The system can accommodate boards as large as 20 x 24", the YTV-1000. Additional features include multi-PC array processing, proprietary cold lighting, an auto-adjust conveyor and Windows XP Pro interface. The YTX-3000 is a cost-effective solution for checking BGA and flip chip components on printed circuit boards, including missing balls, shorts, opens, misalignments and incorrect ball size and shape. Offering enhanced resolution and magnification, the advanced image processor automates the BGA inspection process by identifying defects through the assembly process. Simple programming and ease of use are additional product benefits. YESTech is a leading global supplier of integrated yield enhancement solutions for EMS providers, electronics OEM's, hybrid assembly and semiconductor packagers. For more information, visit www.yestechinc.com.