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NEMI Plans Optoelectronics 'Gap Analysis' Meeting, Discusses Findings of 2002 NEMI Roadmap at Upcoming Conferences
March 25, 2003 |Estimated reading time: 1 minute
Herndon, Va. -- The National Electronics Manufacturing Initiative (NEMI) will present findings from the optoelectronics chapter of its 2002 roadmap and discuss the consortium's optoelectronics initiatives at two industry venues this spring.
Sessions are planned for the Strategies in Optical Manufacturing Conference (April 15 through 16, San Mateo, Calif.) and the Optoelectronics Microsystems International (OMI) Conference (April 28 through May 1, Ottawa, Canada). In addition, NEMI has scheduled a gap analysis meeting May 1 at OMI.
At the Strategies in Optical Manufacturing Conference, David Godlewski, staff manager of planning for NEMI, will discuss NEMI's optoelectronics initiatives on Wednesday, April 16, 8:15 to 8:45 a.m. His presentation will include highlights of the NEMI 2002 optoelectronics roadmap, which focuses on the manufacturing and assembly technologies of optoelectronic components and board-level products.
At the OMI Conference, NEMI will hold an optoelectronics gap analysis meeting on Thursday, May 1, 3 to 5 p.m. This meeting, which is open to industry, will review highlights of the optoelectronics chapter from the recently published 2002 NEMI roadmap, and then identify and prioritize actions to address the technology and infrastructure needs and gaps identified in the roadmap. Follow-up activities may include, for example, university R&D, NEMI workshops, or NEMI deployment projects.
NEMI will also be participating in several OMI conference sessions. NEMI members will be part of a panel discussion on the state of the industry (Wednesday, April 30, 8:30 a.m. to 12:15 p.m.). On this panel, Laura Turbini, Ph.D., Centre for Microelectronics Assembly and Packaging and co-chair of the NEMI Optoelectronics Technology Working Group, will discuss the 2002 NEMI roadmap; Alan Rae, Ph.D., Cookson Electronics and chair of the NEMI Optoelectronics Technology Integration Group, will review gaps identified by the NEMI roadmap as well as optoelectronics initiatives at NEMI; and Tatiana Berdinskikh of Celestica Inc. and co-chair of the NEMI Fiber Optic Signal Performance Project, will discuss optical connector contamination and its influence on optical signal performance.
Other OMI sessions featuring NEMI project leaders include a panel discussion of manufacturability (Peter Arrowsmith, chair of the NEMI Fiber Splice Improvement Project), and a discussion of automation (Prashant Chouta, chair of the NEMI Optoelectronic Soldering Automation Project, plus a paper by the NEMI Splice Improvement Project).
The National Electronics Manufacturing Initiative's mission is to facilitate leadership of the North American electronics manufacturing supply chain. For more information, visit www.nemi.org.