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Herndon, Va. -- The National Electronics Manufacturing Initiative (NEMI) has scheduled "gap analysis" meetings as a follow-up to the findings of its 2002 roadmap.
Several of the meetings will be held at the upcoming APEX 2003 conference in Anaheim, Calif., March 31 through April 2.
The 2002 NEMI roadmap, which will be available to non-members March 31, covers 18 technology, business practice and infrastructure areas, identifying the future manufacturing technology needs in each of these areas. By comparing technology trends with anticipated product needs, the roadmap identifies "gaps" and "showstoppers" that potentially threaten the competitiveness of electronics product realization in the North American region. Follow-up activities may include, for example, university R&D, NEMI workshops, or NEMI deployment projects.
The topics that will be discussed at APEX are board assembly; substrates, including embedded passives; and product lifecycle information management, which covers supply chain communication, factory information systems and other information management topics.
In addition to the gap analysis meetings, NEMI will hold several other forums and open project meetings at APEX. McElroy will discuss highlights of the 2002 NEMI roadmap at an IPC luncheon on April 2. There are two free forums, which are part of the APEX program - Spanning the Virtual Factory (session F11 on April 1) and the Test Strategy Project Forum (session F07-B, also on April 1). NEMI project teams sponsoring industry discussions are: Tin Whisker Accelerated Test Project and User Group, Flip Chip and CSP Underfill Technology Initiative, Optoelectronics for Substrates Study, and the Optoelectronic Soldering Automation Project.
The National Electronics Manufacturing Initiative's mission is to facilitate leadership of the North American electronics manufacturing supply chain. For more information, visit www.nemi.org.