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NEPCON East/Electro to Feature Five Free Educational Sessions
March 13, 2003 |Estimated reading time: 2 minutes
Norwalk, Conn. -- NEPCON East/Electro 2003, the Northeast's leading source for electronics manufacturing solutions, will provide OEMs and CMs direct access to innovative solutions for every stage of the manufacturing process -- from design, packaging and components to assembly and test.
The exhibition will take place on June 10 to 11, 2003, at the Bayside Expo and Conference Center in Boston, Mass. The three-day conference begins one day earlier on June 9.
After spending its first three years in the Philadelphia area, Assembly East, the only Northeast trade event dedicated exclusively to final product assembly, moves north to co-locate with NEPCON East/Electro. Together these three events will provide the regions manufacturers with a single, convenient source for leading edge manufacturing solutions at the board, component and final product assembly levels.
Gregory S. Shelton, vice president of engineering and technology of the Raytheon Co., will present his insights into Design for Six Sigma at noon on Tuesday, June 10, 2003. Shelton will share the successes that Raytheon has experienced with their implementation of Design for Six Sigma. He will include ideas on how Design for Six Sigma drives the total value chain and on critical chain and life cycle optimization through DFSS principles. Shelton will also comment on how Raytheon, and other companies, can optimize the value stream from customer requirements through engineering and manufacturing, and life cycle support.
Pam Gordon from Technology Forecasters will speak on "Designing and Manufacturing to be Lean and Green" on Tuesday, June 10 at 11 a.m. Gordon will discuss how taking new environmental steps helps increase profitability and meets customers' and regulators' increasing requirements for environmental performance.
The Surface Mount Technology Association (SMTA) will again present the SMTA Boston Conference, June 9 to 11. SMTA Boston will provide conferees with the latest technical solutions that they need to stay competitive in today's market. The comprehensive program will consist of a two-day Flip Chip and BGA Packaging Workshop, June 10 and 11, and nine full and half-day SMTA Academy sessions.Sessions include:
- Solder Joint Reliability of Flip-Chip and Chip Scale Package Assemblies
- Ball Grid Array: Principles and Practice Including Rework
- Lead-Free Soldering in a Production Environment
- Lead-Free Solder Joint Reliability
- Troubleshooting the SMT Assembly Process
- Design for Manufacturability
- Surface Mount Technology Fundamentals
- Cost Estimating for Improved Profitability
- Troubleshooting Reflow Soldering for SMT and Area Array Packages
Rounding out the conference program will be "Dispelling Common ESD Myths," presented by the Electro Static Discharge (ESD) Association.New for the 2003 event will be two free SMTA special events. The SMTA's annual meeting, June 11 at noon, will include a presentation, "ET is Finally Pulling Us Upward," by Ken Gilleo of Cookson Electronics. Also on June 11 at 1 p.m. will be an AOI Panel Discussion moderated by Phil Zarrow of ITM Inc.
The IEEE Electro Educational Program committee, in partnership with the Boston Chapter of CPMT (Components, Packaging and Manufacturing, Technology) IEEE Society, will present an educational conference on new and advanced manufacturing technologies. The one-day, four-part program is free to all attendees and will feature the following presentations:
- Lab-On-Chip Technology
- UV Laser-Micro-Machining
- Advanced Packaging Assembly
- Robotic Haptic Systems -- "Arms & Hands"
For complete session descriptions and to register for the SMTA Boston Conference, visit www.smta.org or www.nepconeast.com.