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Dow Corning Completes Acquisition of Tyco Electronics Power Materials Unit
March 4, 2003 |Estimated reading time: 1 minute
Midland, Mich. -- Dow Corning Corp. has strengthened its position in the fabricated thermal interface materials market with the completion of its acquisition of the Raychem Power Materials Business Unit of Tyco Electronics.
The agreement became final on February 27, 2003.
Through the acquisition, Dow Corning has obtained the Power Materials Business Unit's fabricated thermal interface materials (TIMs), electromagnetic-interference (EMI) and radio-frequency-interference (RFI) shielding products, as well as certain connector sealing products that have been sold under the trademarks GELTEK, HEATPATH and DBSEAL. Manufacturing of these products will continue at the current Menlo Park, CA facility. All employees formerly employed by the Tyco Electronics Power Materials Unit have accepted positions with Dow Corning.
With the completion of this transaction, Dow Corning has significantly expanded its fabricated TIMs product line. This is consistent with the latest phase of the company's marketing strategy for thermal management materials. A leading provider of wet-dispensed TIMs, Dow Corning announced its intent to become the top supplier of fabricated TIMs in September 2002.
In addition to the three product lines, Dow Corning gains other assets and benefits from the acquisition. Most importantly, the company increases its customer base by adding the Power Materials Unit's customers.
Dow Corning Electronics, a globally integrated provider of materials, application technology and services, is focused on providing innovative technology for all segments of the electronics industry. For more information, visit www.dowcorning.com/electronics.
Dow Corning provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. For more information, visit www.dowcorning.com.