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APEX Show Guide 2003
December 31, 1969 |Estimated reading time: 12 minutes
"We're showing new products at APEX" seemed to be the mantra for the embattled electronics assembly industry in 2002. Entering its fourth year, APEX 2003, sponsored by IPC — Association Connecting Electronics Industries, has changed times and location, now moved to the Anaheim Convention Center in Anaheim, Calif. from San Diego and taking place March 31 through April 2 instead of the traditional January.
What hasn't changed is the event's uncompromising focus on electronics manufacturing and test. Nearly 500 exhibitors will be on hand, showcasing manufacturing equipment, materials, software and services at the largest North American trade show for electronics assembly.
Free Forums, taking place all three days of the conference, will offer inside information on hot topics of the day, such as optoelectronics, manufacturing in China and lead-free assembly. The conference program boasts 42 sessions and 127 papers, all original to APEX. Professional Development Courses, taking place March 29 through April 2, show you how it is done from experts in the industry. And IPC Standards Development Meetings, taking place March 29 through April 3, are a glimpse into the future of how you do your job individually, as well as a glimpse in the industry's future as a whole.
Through special events, show goers will get a closer look at trends and information affecting the industry today. On Monday, March 31, Robert Herbold, retired executive vice president and chief operating officer for Microsoft Corp., will keynote with "Discipline at the Core, Creativity at the Edge: A Strategy for Improving Profitability and Agility." Author and science historian James Burke will keynote with "Innovation and Change" on April 1, while the University of Stuttgart's Niels Warburg's keynote, "The Science of Lead-free Manufacturing," will take place on April 2. Additionally, networking events such as the Kick-off Reception on the show floor on Monday and the APEX Gala Reception on Tuesday will give show goers a chance to network with industry leaders and technical experts. Also, APEX hosts numerous, significant awards ceremonies taking place throughout the show.
For even more in-depth information on APEX 2003, check out SMT Online (www.smtmag.com) the week of March 24 through 28.
Final Assembly Inspection System
K2-AOI final assembly inspection system is a batch processor reportedly capable of inspecting all visible SMT components, nuts, bolts, labels, through-hole components, LEDs and connectors in place on the board. Edge connector pins are said to be inspected through 45° mirrors set up in the fixtures that hold the boards because of the increased depth of field of the system's 4 million pixel large format digital color camera. Vectron, San Diego, Calif. For free data, visit www.onlinecenter.to/smt.
AOI System
SV-8000 is said to be a technological advancement in AOI that offers multiple customer benefits such as advanced defect detection, flexibility and ease of use, in one seamless package. The system reportedly uses all available inspection technologies, including template and geometric pattern matching, rules-based algorithms, and proprietary intelligent learning algorithms, to ensure maximum defect detection. These algorithms can be applied individually or in combination to eliminate escapes. The systems flexibility also allows it to adapt to changing manufacturing requirements. Photon Dynamics, Aliso Viejo, Calif. For free data, visit www.onlinecenter.to/smt.
Solder Paste
Loctite Multicore 63S4 MP200 no-clean solder paste is said to be formulated with the unique 63S4 alloy that eliminates tombstone defects and reduces component misalignment that occurs when reflowing boards with components such as 0402 and 0201 chips. Suitable for fine-pitch, high-speed printing applications, the solder paste also is said to be a drop-in replacement for standard lead alloys, but offers a wider process window to compensate for inaccuracies in screen printing, pick-and-place, and thermal profiling. Henkel Loctite Corp., Rocky Hill, Conn. For free data, visit www.onlinecenter.to/smt.
Cleaning Solvent
AQUANOX A4512 concentrated cleaning solvent is designed for enhanced cleaning of reflowed no-clean flux residues in aqueous batch or in-line spray machines at concentrations ranging from 5 to 20 percent. To date, the cleaning solvent reportedly has been tested on 86 leading solder pastes, tacky fluxes and wavesolder fluxes with a plus 95 percent success rate. The solvent also is said to be effective on various uncured SMD adhesives. Kyzen Corp., Nashville, Tenn. For free data, visit www.onlinecenter.to/smt.
Conical Target
A new conical target reportedly maximizes achievable magnification as an option for all its transmission X-ray systems. The target's conical shape reportedly is designed to place the focal spot (located at the very tip of the X-ray source target) in between the single components on a populated board without damaging either. As a result, the oblique-angle viewing capabilities of the tube are said to be increased without any corresponding loss of magnification or image quality, even while inspecting stacked package chips or densely populated boards. FeinFocus, Stamford, Conn. For free data, visit www.onlinecenter.to/smt.
Inspection Software
Version 4.7 of SVS software is said to provide customers with easier tools for transporting inspection programs across internal and external networks for storage, and download from central network servers, allowing customers to more easily create program libraries and manage multiple systems. The software also features load and run capabilities, which reportedly allows programs to be created on one SVS system to be loaded and run on other SVS systems without programming adjustment or compilation. GSI Lumonics Inc., Wilmington, Mass. For free data, visit www.onlinecenter.to/smt.
Placement Machine
Siplace HF placement machine reportedly is said to be for flexible, fine-pitch and odd-form placement suitable for in-line or all-in-one production. The machine reportedly is equipped with a fast and reliable linear motor positioning system that delivers 30 µm at 4s accuracy with a placement speed up to 17,000 cph and a component range from CCGAs to 1" tall odd forms and 0201s to 125 x 200 mm. The machine also has 180 feeder inputs that allow multiple feeder setups for reduced changeover times. Siemens Dematic Electronics Assembly Systems, Siemens Dematic AG Div., Norcross, Ga. For free data, visit www.onlinecenter.to/smt.
Placement Platform
GSM Platform for surface mount component placement is said to deliver improvements in utilization, yield, reliability, throughput and ease of use. Enhancements include the company's PrecisionPro feeders that feature a three-point mounting system for better chip component pick presentation; a function that is said to translate directly to improved product yields, especially for small parts. Additionally, dual-track PrecisionPro tape feeders are said to expand the number of component inputs on the GSM Platform to 144 to facilitate improved line balance and utilization. Universal Instruments Corp., Binghamton, N.Y. For free data, visit www.onlinecenter.to/smt.
Alloy
SN100C nickel-stabilized tin/copper alloy is said to be one of the most popular materials for lead-free wave soldering, with approximately 260 lines in commercial production and a further 80 lines scheduled for commissioning at the end of the fiscal year 2002. Productivity and defect rates are said to be similar to those of a line running conventional tin/lead solder. The alloy reportedly is not aggressive toward stainless steel and can be used in a standard pot without the need for a special coating. Nihon Superior Co. Ltd., Osaka, Japan. For free data, visit www.onlinecenter.to/smt.
Pick-and-place Machine
Pick, Place and Press (AP3) reportedly provides the PCB industry a new level of quality assurance, throughput and flexibility in a SMEMA-compatible servo electric press. The system is said to be able to pick, inspect, place and press components with ±0.003" accuracy in 4 to 6 seconds. Real-tile graphical SPC data also is produced and archived for every component applied for quality assurance. Tyco Electronics, Harrisburg, Pa. For free data, visit www.onlinecenter.to/smt.
Solder Inspection System
VT-WIN II PCB solder inspection system can be used either in- or off-line for rapid, accurate identification of various circuit board assembly defects. The system is said to have advanced algorithms that enable proper inspection of leading technology processes, such as lead-free solder. The system's software, which is programmed via CAD placement data, also incorporates intelligent algorithms to reduce operator-programming time. Omron Electronics LLC, Schaumburg, Ill. For free data, visit www.onlinecenter.to/smt.
X-ray Inspection System
The XD series Digital X-ray Inspection Systems (XiDAT) reportedly offers highly improved digital data processing, enhanced resolution, extensive grayscale definition and Version 5, Image Wizard software operating system. The system is said to acquire images with a resolution of 1,300 x 1,000 pixels and more than 65,000 levels of grayscale. Its imaging chain also can resolve four times the number of grayscale levels compared to analog systems. Dage Precision Industries Inc., Fremont, Calif. For free data, visit www.onlinecenter.to/smt.
Thermal Profiling Software
KIC Auto-Focus software reportedly develops reflow recipes for new products without running a profile by evaluating a database of previously setup products, and extrapolating a new oven recipe based on product and oven characteristics. The software automatically calculates the proper oven recipe, which means the user only needs to enter the product's length, width and weight. KIC, San Diego, Calif. For free data, visit www.onlinecenter.to/smt.
Polyester Material
Thermx CGT33 is a PCT glass-filled polyester that reportedly offers a drop-in replacement for existing PBT molds as an alternative to nylon in applications requiring high-thermal stability. Its high-melting point of 290°C is said to make it an ideal material for high-temperature IR soldering applications. The material also maintains its dimensional stability even in hot and humid environments, which causes no need for special storage or handling. Eastman Chemical Co., Kingsport, Tenn. For free data, visit www.onlinecenter.to/smt.
In-line Stencil Printer
E5-36 is a large format in-line stencil printer that features a print area of 36 x 24". The automatic printer offers other features such as a patented vision alignment system with software-controlled variable lighting technology, 2.5-D post-print inspection and vacuum stencil wiping. When processing large PCBs, these features, combined with a heavy-duty transport system, reportedly allow for the same repeatability and robustness performance levels as when printing smaller substrates. EKRA America, Marlborough, Mass. For free data, visit www.onlinecenter.to/smt.
AOI Interface
EasyPro is a user interface for its circuit board inspection systems that reportedly optimizes and simplifies programming and control, making machine operation simpler than ever. The interface is said to be present in just a few clear displays, which include inspection, programming mode and service mode. A further new feature "guides" users in the interactive mode, assisting them with interactive wizards at all points where help might be required. Viscom USA, Norcross, Ga. For free data, visit www.onlinecenter.to/smt.
Chip Placer
CP-65E chip placer reportedly is for industrial applications requiring placement of large memory components and large logic IC devices at high speeds. The placer is said to offer component support from 0603 (0201) to 30 x 30 mm, and tape widths to 44 mm. The servo-driven, cam-actuated rotary turret also features 20 nozzle shafts, with six nozzles per shaft head. The chip placer's heavy-duty conveyor reportedly can accommodate boards weighing up to 2 kg. Fuji Machine Mfg. Co. Ltd., Aichi-ken, Japan. For free data, visit www.onlinecenter.to/smt.
Transfer Heads
A series of low-volume ProFlow transfer heads reduce costs and enhance the precision of high-accuracy mass imaging, using small quantities of high-value materials. These include fine particle, low-alpha solder pastes and high gold content compounds used to create grid arrays and other features in advanced packages such as CSP and flip chip. These new additions are said to achieve high accuracy and repeatability in processes requiring individual deposits less than 200 mg. DEK International GmbH, Zurich, Switzerland. For free data, visit www.onlinecenter.to/smt.
Inspection and Taping System
ST-588 LC is a high-speed inspection and taping system for leadless chip carrier devices. The key to the system's unparalleled inspection capabilities reportedly is the integrated SureView inspection module that performs simultaneous inspection of the bottom and side surfaces of LCC devices. RVSI, Canton, Mass. For free data, visit www.onlinecenter.to/smt.
Automated Pick-and-Place
The Gold-Place series of automated pick-and-place systems are said to be low cost for medium-volume SMD placement. Some capabilities reportedly include various applications ranging from 0201s to 0.015" fine pitch to BGAs, with up to 96 feeders and rates up to 4,800 cph. Some options include laser centering, SuperStrip feeders, and a fluid dispenser for various pastes and adhesives. Automated Production Systems Inc., Huntingdon Valley, Pa. For free data, visit www.onlinecenter.to/smt.
Solder Paste
ALPHA WS-709 water-soluble paste is said to be ideal for applications involving extended open time and wide ranges of demanding environmental conditions. Some features include a humidity resistance of 25 to 75 percent RH, a print temperature range of 68° to 82°F and an open life longer than 36 hours. Cookson Electronics Assembly Materials, Franklin, Mass. For free data, visit www.onlinecenter.to/smt.
Dispensing Software
Fluidmove Version 4.5 for Windows NT (FmNT) dispensing software is said to feature enhancements in throughput, fluid management and process control. Cycle times reportedly are optimized with the addition of Variable Valve Speed, a tool that allows for the programming of multiple material flow rates per board without necessitating dual valves. Test results also indicate that Variable Valve Speed technology has the ability to cut dispense times in half. Asymtek, Carlsbad, Calif. For free data, visit www.onlinecenter.to/smt.
BGA/SMT Rework System
BANDIT BGA/SMT rework system is said to offer high-power, low-temperature rework, flexibility and programmability in a precise and repeatable system. Incorporating electromechanical/pneumatic operation, the rework system reportedly is a lead-free compliant, CE certified benchtop unit that uses controlled, directed heated air and interchangeable nozzles to remove, align and replace BGAs, SMDs, connectors and other devices quickly and repeatably without PCBA damage. A.P.E. South, Key Largo, Fla. For free data, visit www.onlinecenter.to/smt.
Pick-and-place Technology
The new Fine Pitch Module in combination with the company's FCM Multiflex chip shooter reportedly provides scaleable production capacity from 100 to 200 kcph throughput, with from 260 to 520 part numbers supporting family setup for fast changeovers in high-mix environments. Features of the module also include the broadest component range from ICs through advanced packages to odd forms, patented Continuous Calibration for 25 µm at 4 sigma placement accuracy, and state-of the-art software solutions. Assembléon, Eindhoven, The Netherlands. For free data, visit www.onlinecenter.to/smt.
Collaborative Manufacturing Software
Teradyne SCE 3.0 collaborative manufacturing execution software is said to break down the barriers between suppliers, manufacturers and customers, providing greater manufacturing control through process visibility and product traceability. This software version reportedly features a significantly enhanced capability to link global OEMs and EMS providers, accelerate new products to market, and reduce manufacturing costs. Teradyne Inc., Assembly Test Div., Boston, Mass. For free data, visit www.onlinecenter.to/smt.
Large-board Table
ML7 (Manual Load 7 Module) large-board table reportedly can accommodate PCBs up to 44 x 32" (1,117.6 x 812.8 mm) and that weigh up to 11 kg (24 lb). This large-board capability is said to offer a flexible solution where all board sizes can be produced, regardless of batch or complexity. MYDATA automation Inc., Rowley, Mass. For free data, visit www.onlinecenter.to/smt.