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IPC Releases APEX 2003 Technical Conference Schedule
January 22, 2003 |Estimated reading time: 2 minutes
Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries has announced the technical conference sessions to be presented at IPC SMEMA Council's APEX 2003, being held March 31 through April 2, at the Anaheim Convention Center in Anaheim, Calif.
In addition, the association has created a special package for registrants of IPC SMEMA Council's APEX and IPC Printed Circuits Expo 2003, being held one week prior on March 22 through 27 at the Long Beach Convention Center in Long Beach, Calif.
The 2003 APEX Technical Conference will welcome numerous global experts from OEM companies, suppliers and EMS manufacturers to present their findings on topics ranging from the latest in test and test strategy to materials and processes for assembly to the effect of manufacturing and materials selection choices on environment.Of the more than 100 papers that will be presented in 42 technical sessions, the three-day conference will include the following highlighted events:
- Roadmap 1, Roadmap 2 -- These two sessions will present insight and timelines on how technology is evolving and what worldwide customers will require in the future. Updates on high speed networks, MEMS, optoelectronics and other emerging technologies will also be presented.
- OEM/EMS 1, OEM/EMS 2 -- Experienced OEM and EMS engineers will discuss the possibilities, potentials and pitfalls of EMS outsourcing in these two sessions.
- Environment: Material, Recovery and Recycle -- Papers on solder processing and advances in packaging technology for electronic products will cover ways to minimize the environmental impact of assembly processes.
- Industry Recycling Trends -- In this panel, experts from worldwide academic and industrial communities will address several important issues regarding electronics recycling and end of life management.
- Environmental Impact of Manufacturing (Life Cycle) -- Industry, academia and government leaders will discuss the latest research about life cycle analysis of electronics assembly with both lead and lead-free solders.
- Assembly Challenges -- In this session, research on new packaging materials for optoelectronics and the impact of lead free on the new packaging technologies will be presented.
Additionally, in an effort to create greater synergism between both the IPC SMEMA Council's APEX 2003 and IPC Printed Circuits Expo 2003 shows, IPC has created a special package for registrants of both shows. Attendees who register online for any APEX event and then register for an IPC Printed Circuits Expo activity will receive a free APEX conference proceedings CD at IPC Printed Circuits Expo. Conversely, attendees who register online for any IPC Printed Circuits Expo event and then for an APEX activity will receive a free IPC Printed Circuits Expo conference proceedings CD at APEX. In addition, attendees who register for an Extra Value Package (A-D) at either show will receive a 25 percent discount off any activity at the supplementary show, and those who meet the February 14 early registration deadline will save an additional 10 percent.APEX features all segments of the electronics assembly industry, from bare boards to tested assemblies, and is the only show in North America that showcases machinery from every major pick-and-place equipment manufacturer.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,400 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org.