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August Technology Enters Development Agreement with Leading Semiconductor Manufacturer
January 10, 2003 |Estimated reading time: Less than a minute
Minneapolis -- August Technology has entered into a development agreement with one of the world's top 10 semiconductor manufacturers.
The collaboration will move August Technology's inspection technologies into new crucial areas of the wafer fabrication process by leveraging August Technology's extensive capabilities in rapid automated defect inspection with the partner's leading edge device manufacturing expertise.
August Technology's automated inspection solutions provide critical product and process enhancing information, which enable microelectronic device manufacturers to drive down costs and time to market. According to Gartner Dataquest's Midyear 2002 Semiconductor Manufacturing Market: Wafer Fab Equipment report, the overall process control market is estimated to grow by 25 percent annually, nearly doubling in size to $5.40 billion in 2005 from $2.76 billion in 2002.
August Technology is a founding member of the Advanced Packaging and Interconnect Alliance (APiA) and an active member of the Die Products Consortium (DPC). For more information, visit www.augusttech.com.