Ask and Answer - June 5, 2002


Reading time ( words)

QUESTIONSRuben E. Irizarry-Guzman writes: I am currently experiencing some solder voids. And there are two alternatives to solve it. On the first hand there is a tradition that says that the profile shall be between 3-6 minutes total time. Then there we have the traditional flat profile vs. the ramp profile. Some theories say that with a longer soak zone you reduce voiding but there is also a theory that says that with a continuous ramp profile you do the same. Can you advise? Thank you. Reference Number: 060501

Minneapolis and Plano, Texas -- August Technology Corp. has entered into a definitive agreement to acquire Semiconductor Technologies and Instruments Inc. (STI).

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