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Toshiba, Tessera Sign Expanded Licensing and Technology Agreement for Chip-Scale Packages
June 7, 2002 |Estimated reading time: Less than a minute
Using Tessera's core CSP patents, these FBGA packages, also marketed by Tessera as µBGA-F packages, currently are used by Toshiba in applications including logic, memory and multi-chip devices, which are incorporated in a diverse range of computing, communications and consumer electronics products.
Haverhill, Mass. and Singapore -- DL Technology, LLC has formed an alliance with Axend Private Ltd. for sales representation in Singapore, Malaysia and Thailand.