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New Products
December 31, 1969 |Estimated reading time: 10 minutes
Series of PreheatersThe Dragon Series preheaters work in conjunction with rework equipment to ensure safe, reliable rework through programmable preheating of circuit boards and assemblies, and to prevent or minimize thermal shock and warpage. The hot air-based preheaters reportedly deliver air from the board's bottom side so that topside components can be reworked. The simple Dragon is a 1,200 W, 4 x 4", 120 V system that uses interchangeable nozzles and the rugged 1,200 heater to preheat a specific area of the circuit board. The Super Dragon is said to deliver 2,400 W of heat through two heaters over a 12 x 12" area while the Monster Dragon delivers 4,800 W through four heaters over a 24 x 24" area. A.P.E. South, Key Largo, Fla.
Printing TechnologyPumpPrinting enables high-throughput adhesive deposition onto pre-populated or pre-printed PCBs using a screen printing platform. This stencil technology reportedly allows proper stencil gasketing to the PCB, while clinched leads or other devices are present on the board. The process is said to be completed in a single stroke, and cycle times are constant and independent of the number of adhesive deposits. DEK, Flemington, N.J.
IR Screening SystemISIS 7070 in-line infrared circuit verification system is said to enhance PCB assembly. By positioning the system after reflow, manufacturers reportedly can verify board integrity prior to functional testing, while at the same time isolating processing problems so that corrective action can be taken before defective boards accumulate. The screening system uses an infrared camera that detects heat dissipated by electronic assemblies that have been electrically powered. A defect can cause areas of the board to radiate either too much or too little heat. The system compares these areas to a statistical model and determines that the board has either passed or failed. ART Advanced Research Technologies Inc., Saint-Laurent, Canada.
Digital CalipersThe MicroImage VMU series of digital video calipers allows high-resolution, video-based, noncontact measurement in the X, Y and diagonal directions. Precise calibration is entered through the numeric keypad and is said to cover a range of 0.0001 to 9999, with a resolution up to 1/1,280. All measurements reportedly are said to be calculated digitally, eliminating the drift and scale errors found in analog-based units.
FEATURE PRODUCTS
Test and Inspection SystemThe microfocus X-ray .20 series has been redesigned with improved X-ray tube and imaging chain technologies. The standard features of the series still include an ergonomic console for optimized inspection settings, an ultra-high precision tilt and rotate manipulator system, real-time measurement capabilities, and multiple fields of view. Some new features reportedly include the latest X-ray imaging capabilities and more imaging chain choices, such as the direct digital X-ray detector (DDD). FeinFocus USA Inc., Stamford, Conn.
Dispensing SystemThe Snap servo controlled pump produces programmatically controlled pixel sizes down to a small volume of less then one nanoliter. Accuracy-producing components are inexpensively, quickly and easily cleaned and replaced in the field, eliminating the need for backup pumps and expensive refurbishment. The pump action is said to deliver a positive shut off while dispensing each fluid pixel, preventing leaking and wasted material. Creative Automation Co., Sun Valley, Calif.
CLEANING MATERIALS & EQUIPMENT
Clean Air SystemsMicro Air clean air systems reportedly use source capture exhauster arms, portable source capture air cleaners, dust collectors, ambient air cleaning units and large ducted collection systems to rid plant air of laser cutting pollutants. The systems' Roto-Pulse cartridge cleaning system is said to clean filter cartridges automatically, resulting in lower maintenance costs and longer filter life. Custom engineering also is said to be available for specific laser cutting applications. Micro Air, Wichita, Kan.
Cleaning SystemMega II's closed-loop solvent (or water) electronic assembly and parts cleaning system with quantitative ION detection and SPC capability reportedly is targeted for use in flip chip, optoelectronics, and advanced or high-reliability technology packages and assemblies. The system's wash and rinse cycles are said to incorporate a spray under immersion process, with strategically located venturi nozzles. The agitation can be controlled to handle sensitive wire bonded substrates or tight tolerance flip chip technology. An ultrasonics assist is said to be available as an option for tough cleaning requirements. Austin American Technology Corp., Austin, Texas.
CleanersDynasolve GC5200, GC5210 and GC5215 cleaners reportedly remove oily and particulate soils. GC5200 is an aluminum-safe aqueous-based cleaner that can remove oil, grease, waxes and other contaminants from precision ferrous and non-ferrous metals. GC5210 is said to be a high-strength aqueous-based cleaner designed for removing heavy-duty oils, greases and cutting fluids from various substrates. GC5210 will remove PTFE and molybdenum lubricants from intricate substrates with ultrasonics or heating. GC5215 is a low foaming version of GC5210 that can be used in high-pressure spray equipment. Dynaloy Inc., Indianapolis, Ind.
COMPONENTS
ArraysCHC Series arrays in BGAs feature power ratings from 0.5 W (in the 0865 package) to 1.6 W (in the 1065 package), and are targeted for use in portable products and high-speed switches. The construction of these chip scale termination arrays features eutectic solder bumps on a ceramic substrate, which is said to deliver devices with low parasitic inductance and capacitance values. This construction reportedly leads to a reduced ground bounce, improved speeds and more consistent propagation delays. International Resistive Co. Inc., Advanced Film Div., TT electronics plc, Corpus Christi, Texas.
Elastomeric Connectors Silver ZEBRA elastomeric connectors reportedly feature high-density, low-resistance, and high electrical and mechanical reliability. The connectors are constructed from alternating parallel layers of nonconductive and silver-filled electrically conductive silicone, which provide a redundant connection. The connector's design is said to be available with 0.05 mm dielectric barrier or silicone rubber barriers from 0.38 to 1.5 mm. Applications include aerospace, military, automotive and electronics. Fujipoly of America Corp., Kenilworth, N.J.
Line TransformerC1971 line transformer features the EP13 package style in a surface mount design and meets the various agency requirements for supplementary insulation at 250 V. It measures 0.480" in height and has a turn ratio of 1:1.2. CoEv, Div. of Tyco Electronics, Watertown, S.D.
Diode ArraysThe SP05xC family of transient voltage suppressor (TVS) avalanche diode arrays in a CSP are designed to protect analog and digital signal lines from ESD transients. Some features of the series include a small footprint, capacitance of 39 pF, clamping voltage of 12 V, low leakage current and a sub-nanosecond response time. The series also reportedly can sustain ESD of 18 kV per IEC standard, and 30 kV per the Human Body Model (HBM). Littelfuse Inc., Des Plaines, Ill.
DISPENSING EQUIPMENT
Rework DispenserThe Rework Dispenser 05, a compact and easy-to-use solution for solder joint repair of QFPs, BGAs, CSPs, CBGAs or PSGAs, is a version of the Dot-Liner. The unit is said to come standard with an advanced time pressure dispenser, easy dispense windows software, a camera system and stable axes. MARTIN GmbH, Wessling, Germany.
Vision EngineITI vision engine was developed to boost the power and usability of dispensing equipment on both the Century and Millennium platforms. The vision engine is said to provide an enhanced pattern recognition system with high-speed cameras, image processors and powerful software that automatically corrects workplace misalignment. Together with the company's Fluidmove NT software, the vision engine reportedly features a series of measurements to find die edges and calculate the corner of the die. Asymtek, a Nordson Co., Carlsbad, Calif.
Liquid Dispensing SystemMicroMax II Dispenser reportedly is for heated applications in semiconductor packaging and HDI, including flip chip underfill, dam-and-fill encapsulation and cavity fill. The system has a composite base that offers exceptional stability, as well as a footprint of 36.5 x 47.0 x 59.5" and work area of 12 x 12". The system reportedly has a dispense speed up to 30" per second, maintains thermal consistency, and can be operated as a conveyorized system for PCBs or boats/carriers. It is said to use a real-time multi-tasking operating system with proprietary dispensing software displayed in an X windows format. GDP Global, a LIFT Industries Inc. Div., Grand Junction, Colo.
HARDWARE & ACCESSORIES
Resettable FuseBBR550 and BBR750 Models are designed as new, coated versions of the company's 90 V radial-leaded PolySwitch resettable fuses. These devices facilitate the provisioning of cable telephony and protect against potentially damaging power faults to cable power-passing tap ports and set-top boxes. The fuses are said to be available with rated hold currents of 550 and 750 mA. Designed to help limit current in the event of power cross-faults on the coaxial cable, the devices reportedly are available in either straight-lead or kinked-lead configurations, and are supplied in tape-and-reel packaging for compatibility with high-volume assembly. Raychem Circuit Protection, Tyco Electronics Corp., Menlo Park, Calif.
Test and Burn-in SocketsTest and burn-in sockets for fine-pitch BGA/LGA-IC398 Series feature a smooth rounded cup as a contact tip, which reportedly minimizes ball damage and features a good contact force. To meet the 0.5 mm grid space, contact was designed as bow type and force is linear. To meet customer demands, the series has a standard base, which accepts different size ICs by incorporating a new guide frame and latch. Currently, maximum acceptable grid size is said to be 18 x 18". Yamaichi Electronics USA Inc., San Jose, Calif.
Socket BGA TerminalsRollerball Socket BGA terminals are said to reduce rework and scrap while increasing production yields. The design features a hole at the bottom of the terminal. Then the terminal reportedly is crimped over the solder ball, beyond its hemisphere to encapsulate the solder ball, bringing the terminal closer to the solder pad, reducing coplanarity PCB problems and leaving just enough of the solder ball exposed to provide sufficient solder for soldering to a PCB. Andon Electronics Corp., Lincoln, R.I.
ContactsHigh-frequency test sockets feature replaceable Microstrip Contacts that enable the change out of contact strips by the user at the actual test site. The test sockets, used throughout RF/microwave, automated handling and burn-in/life testing applications, no longer need to be returned to the factory for routine contact strip replacement. The contacts, which can be used for any pitch device up to 208 leads, reportedly feature a low dielectric strip that holds the contacts in place for accurate lead placement. This flexible contact system becomes part of the PCB microstrip during device testing. Aries Electronics Inc., Frenchtown, N.J.
SOLDERING EQUIPMENT
Clean Process OvenThe LCC oven is designed for production environments requiring more space for larger parts or bigger loads. The oven reportedly is stackable to save floor space, and all the serviceable components are said to be easily accessible for maximum efficiency. The oven's 1.6 cubic ft. chamber is said to be large enough to handle processing applications for both 200 and 300 mm wafers, as well as for larger parts and bigger loads. Despatch Industries, Minneapolis, Minn.
Selective Soldering SystemSelective soldering system is said to offer fully modular setup, allowing for upgrades in the field, and its robust, flexible platform offers various modules that can be added and interchanged based on a "plug-and-play" principle. Its X/Y system reportedly offers full process flexibility and high throughput via its "smart" subsystem setup. Flexible SecureGrip systems in combination with a programmable MultiFlex are said to minimize the need for customized tooling and applications. Multiple preheat zones address the need for higher preheat requirements without impacting cycle times. Vitronics Soltec BV, Oosterhout, the Netherlands.
Curing SystemWork Station is designed to be safe and user-friendly for processes using light curing adhesives and coatings. Constructed of durable, lightweight, clean room compatible brushed aluminum, the reflector housing and shutter are mounted in the shield and stand. The autoranging power supply is said to adjust to variations of incoming current automatically. It reportedly allows complete viewing of the curing process and is designed to be height adjustable to accommodate part size variations. The shutter opens to allow manual or automatically timed exposure to light. As the door opens, the shutter is activated to close completely, shielding the operator from exposure to UV light. Dymax Corp., Torrington, Conn.
Automated ProcessesThe Corfin DTS Series is a line of conveyorized systems that automate soldering and solder coating processes across various components. The series reportedly provides durable solder finish on component leads and soldered component terminals, and can be configured for single components, components in strip form, or reel-to-reel applications. DTS 100 and 200 are suited for high-temperature soldering of small transformers, coils and bobbins. DTS 330 and 400 address a wide range of components such as DIPs, SIPs, and most SOIC and PLCC configurations. The systems are said to be capable of achieving throughput up to 90,000 uph with the continuous feeder conveyer. Corfin Automation, Salem, N.H.