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New Products
December 31, 1969 |Estimated reading time: 7 minutes
Paste FluxFluxPlus is a tacky paste flux that provides an effective alternative to messy liquid fluxes in SMT assembly process, repair and rework procedures, BGA and sphere attachment, and solder bumping applications. The two versions of the paste flux, one for dispensing and one for printing, both reportedly provide resistance to slump, and contain the tack strength needed to hold components or BGA solder spheres in position. The dispensing flux area is said to be available in 3, 10, 25 and 50 g syringes and printing fluxes in 50 and 150 g jars. EFD Inc., Lincoln, R.I.
Wafer-level TestingIntegration of the Summit Series wafer probing systems and the Polytec Micro-Scanning Laser Vibrometer (MSV) provides an automated, non-invasive device during the MEMS optical switch manufacturing process. The system reportedly makes a noncontact deflection measurement using a targeted laser spot at selected points on each device. Inside the vibration isolated and shielded MicroChamber environment, important switch response characteristics such as deflection amplitudes, settling times resonant frequencies and cross-talk can be determined. Dynamic MSV characterization combined with prober control software is said to provide a test solution for optical switch characterization and functional tests. Cascade Microtech Inc., Beaverton, Ore.
Thermal Interface MaterialsABLETHERM 3100 Series advanced thermal interface materials are for flip chip BGA packages and reportedly feature low modulus and high adhesion. This combination of features is said to provide heat transfers and device reliability. The materials also feature low moisture absorption, which contributes to adhesive reliability during 200 hours HAST exposure. The material's stress bond between the chip and thermal lid reportedly survives 1,000 temperature cycles under condition B without delaminating. Ablestik, Rancho Dominguez, Calif.
Mixing ValveFor use with two-component urethanes and epoxy materials, Model 442 Dynamic Autovalve reportedly combines the benefits of dynamic mixing action with disposable mixing chambers. The autovalve reportedly can be used with new Meter Mix Systems or retrofitted to an existing system and the A/B components are ported separately through the valve body and manifold, and combine at the dynamic mixer inlet through a sequenced start. The rotating impeller is said to consist of a string of disposable helical elements, and the rotating speed can be adjusted from 200 to 4,000 rpm. TAH Industries Inc., Robbinsville, N.J.
Pressure Control Screen PrinterMK-878SV is a fully automated in-line printer offering patented technology APCS (automatic pressure control system). Print heads and SUS squeegees deliver accurate and consistent print profiles. The system is built for ease-of-use, allowing end-users to take advantage of printer functionality without a large learning curve. MINAMI America Inc., Torrance, Calif.
Data ConversionCircuitCAM 4.0, the current version of the universally accepted data conversion program used with the company's circuit board plotter, has been upgraded with various enhancements. The update reportedly includes wizards that guide the user step-by-step through the most important program sections. The wizard is said to constantly inform the user concerning current working status and makes it easy to change between graphics and wizard modes. As an ideal solution provided for users who need results even faster, the new batch function comprises default settings with fixed parameters, enabling an automatic program run in the background. LPKF Laser & Electronics AG, Garbsen, Germany.
ASSEMBLY TOOLS & EQUIPMENT
Tooling SystemThe Auto Pin Guidance Tooling System combines the speed and dexterity of operators with the repeatability of the machine's vision gantry. It reportedly incorporates a vision-mounted laser pointing system for guiding where to place the pins for supporting double-sided assemblies. For process control feedback, the tooling system is said to use the vision system to recognize pins and verify correct position. Pin locations can be taught via the vision system or by using the CAD data off-line. EKRA America, Marlborough, Mass.
Precision Inspection TablePrecision X-Y Table offers precise movement in start-stop modes, no additional travel when movement stops and movement in both planes with the punch of a button. The table reportedly is ESD-safe and can be used with static-dissipative pads. Equipped with a new stainless-steel double glide arm, incorporating ball bearings that make travel smooth and precise for easy and accurate positioning, it also is said to feature a double-rod glide arm designed to give strength and rigidity without sag or wobble. O.C. White, Three Rivers, Mass.
INSPECTION EQUIPMENT
AOI SystemOptiCon Paste Inspector is a 3-D device for solder paste inspection, reportedly checking the solder paste print of each single pad for the following characteristics: topography, volume and expansion on the board. At the heart of the system is a CMOS camera situated in a rack together with the ALU. The intelligent camera is said to process the data in real-time, i.e., without any delay and data loss. The data is transmitted to a PC, which displays the results and parameterizes the systems. GOEPEL Electronic GmbH, Jena, Germany.
High-resolution X-ray SystemThe Oversized Jewel Box 90-C facilitates X-ray inspection of larger assembled PCBs up to 18 x 24". The system's 90 kV, 4 μm focal spot X-ray tube reportedly allows magnifications of greater than 3,000X for inspection of microBGA, flip chip and CSP packages. The system is said to feature a 5-axis positioner, permitting full scanning of a 17 x 17" area with 360° rotation of boards up to 16 x 16". The system includes the company's GTI-5000 advanced image processing software that runs on a Windows 2000 platform. Glenbrook Technologies, Randolph, N.J.
PICK-AND-PLACE EQUIPMENT
Bulk-to-Tape SystemA part of the NT16 family of tape-and-reel systems, NT16QFN offers a customized solution to the demand for inspecting and handling QFNs. Featuring a high-speed, precision, 16-position rotary vacuum turret, the system is said to afford the flexibility to combine several separate test and inspection systems. The machine reportedly accepts input from bulk, and outputs to two tape-and-reel systems at up to 12,000 parts per hour. Automatic tube handlers for input or output also are available on request. Ismeca USA Inc., Vista, Calif.
SP FeederUptime Series SP Feeder interfaces one-on-one with various machines without special modifications. The user reportedly can be up and running within minutes and can reload continually without stopping the machine to discard cover tape. This feeder is said to improve machine throughput up to 30 percent and can handle pocket depths up to 23.5 mm. Programmable electronic pick-up positions can vary from two to 56. Hover-Davis, Rochester, N.Y.
SOFTWARE
Vision SoftwareThe IMAQ Vision Builder 6.0 is vision software that simplifies the creation of machine vision applications with a step-by-step guide to automatically creating LabVIEW virtual instruments. In the past, the software produced text recipes with which users could write LabVIEW virtual instruments. Now, with this software, the product automatically launches LabVIEW and LabVIEW draws the virtual instruments. With this product, it is expected that engineers and scientists can create and prototype machine vision applications that use color pattern matching. National Instruments, Austin, Texas.
Management SoftwareEncore! Composer 3.1 is a specification management software that simplifies the processes of creating and editing as well as factory specifications. Its graphical user interface reportedly simplifies creating, editing, viewing and querying factory specifications of the various components in a computer integrated manufacturing environment. The software is Windows-based and automatically handles persistency, version control, access control, extensibility and document management system integration. PRI Automation Inc., Billerica, Mass.
REWORK & REPAIR
Bonder AttachmentModel 870 is an attachment designed for removing flip chips that have been bonded using new reworkable underfill/flux materials. This attachment option reportedly includes a focused chip heat source, a heated stage with substrate holder that keeps the substrate flat and evenly heated, a chip grabber for pulling/shearing off the chip, a microscope with illuminator for alignment, a control box with a power supply, and provision for site cleanup. An external computer is said to display thermal profiles and upload them to the model's temperature controller. Semiconductor Equipment Corp., Moorpark, Calif.
Repair Skills Certification KitIPC 7721 Repair Skills Certification Kit is designed for experienced board repair technicians, operators and trainers seeking to obtain or renew official IPC certification. Using the materials and instructions included, technicians reportedly can complete the work assignment at their own pace, without pressure or deadlines. Once completed, they return the projects to the company, an IPC-registered training facility, for evaluation, and will receive official IPC certification. Circuit Technology Center Inc., Haverhill, Mass.
BGA Rework StationsAvailable in two models, the CSP-3500 is designed for smaller chip scale rework, and the BGA-3590 is designed for high-power under-board heating for thermally demanding PCBs. The systems' abilities to provide optimum clarity greatly improves the integral vision system that simplifies both the placement of components and stencil alignment. The unique prism feature reportedly allows users to simultaneously look at the top of the PCB and a superimposed image of the component under the PCB. Both models are said to use Windows-based process control and monitoring software that ensures a precise four stage profile, while a low airflow forced convection system produces an even DT underneath a component and minimizes adjacent reflow. Metcal, Menlo Park, Calif.