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IPC Printed Circuits Expo 2003 Technical Conference and Educational Courses to Incorporate Design Issues
December 10, 2002 |Estimated reading time: 2 minutes
Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries has announced the technical conference sessions and tutorial and workshop schedule for IPC Printed Circuits Expo 2003, which takes place March 22 through 27 at the Long Beach Convention Center in Long Beach, Calif.
With the inclusion of the IPC Designers Council Summit, the event has a new emphasis on printed circuit board (PCB) design.
The IPC Printed Circuits Expo 2003 technical conference program, which is held Tuesday through Thursday, March 25 through 27, focuses on the latest technological advances in the PCB industry and provides the most comprehensive information about new materials, techniques and processes. Two sessions, PCB Design Operations I and PCB Design Operations II, offer designers essential techniques for improving the performance of final assembled circuit boards, including topics on differential TDR, reliability, metric grid incorporation and organic light-emitting devices.
Other technical conference sessions will focus on PCB properties, technologies and materials; advanced packaging using HDI and flexible circuitry; PCB testing for troubleshooting, reliability and UL approval; PCB fabrication; designing for HDI, high speed and high frequency; and embedded passive devices.
The IPC Printed Circuits Expo 2003 Tutorial and Workshop schedule consists of more than 40 full- and half-day programs, taking place Sunday through Monday, March 23 through 24 and Thursday, March 27. Seventeen design-focused tutorials and workshops have been integrated into this year's program, including the following:
- Flexible Circuitry for Engineers
- Laminates and Multilayer Stack-Ups: The Golden Keys to Optimum Performance
- PCB Design for RF Applications
- Flexible Circuitry Advances: Materials, Processes and Applications
- High Speed Design and Impedance Control
- Electrical Engineering for the Non-Degreed Engineer
- Micro-Via and High Density Sequential Build Up PCB Design
- Effective Design for Manufacture
- Ground Bounce, Bypass CAPS and ESR
- Demystifying Controlled Impedance Boards for Non-Engineering PCB Professionals
- Purchasing PCBs
- The PCB Manufacturing Process: A Brief Tour
- Next Generation Interconnections: Photonics and Beyond
- EMI Control at the PCB Board Level
- The How and Why of Obtaining Accurate Impedance Calculations
- Pad Stack Design and PCB Stack-Up Generation for High Yields
- Embedded Resistors and Capacitors: Materials, Processes and Applications
Industry experts will also train attendees on additional PCB issues that focus on selecting, qualifying, and managing a PCB manufacturer, the fundamentals of PCBs, Embedded Passives and Microvia Formation, advanced PCB troubleshooting and understanding National Technology Roadmaps, just to name a few.
The IPC Designers Council is a professional society of designers forming an international network. Its mission is to promote printed board and printed board assembly design as a profession and to encourage, facilitate and promote the exchange of information and integration of new design concepts through communications, seminars, workshops and professional certification through a network of local chapters. For more information, visit dc.ipc.org.
IPC is a trade association dedicated to the competitive excellence and financial success of its more than 2,500 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. For more information, visit www.ipc.org