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Improving Yields Through Software
December 31, 1969 |Estimated reading time: 2 minutes
SAN JOSE, Calif. — To maintain an edge in a declining industry, many OEM and EMS suppliers of surface mount boards have turned to process controls to improve their yield. With the slow equipment market, one bright spot has been the growth in AOI, AXI and related process control software.
Photon Dynamics has gradually expanded its products to improve yields in the board inspection area. For instance, the company's AOI systems inspect for visible defects such as component presence, orientation, solder integrity and skew. Their X-ray inspection systems provide a nondestructive means for seeing hidden solder point connections. Photon Dynamics' integrated X-ray and optical system checks visual features as well as hidden ones, such as BGA connections, only visible via X-ray.
In July, Photon agreed to acquire the Infrared Screen and Inspection Solutions (ISIS) Division of Quebec-based ART Advanced Research Technologies. Through ISIS infrared (IR) verification system, electronics companies can have a rapid, cost-effective end-of-line screening and off-line inspection and failure analysis tool. Through IR verification, power is applied to the assembled board, which then radiates heat in a characteristic manner.
In September, Photon Dynamics announced RTI 4.9, a software enhancement for their SV-7550 AOI system and the SVX-2000 AOI and X-ray combined system. The new software versions reportedly are easier to set up and cut false calls through advanced intelligent algorithms.
Whether by acquisition or in-house improvements, "we want to be the data collection analysis, storage and feedback suppliers providing part of a quality management solution," said Photon Dynamics Manager Kevin O'Reilly. There are many methods for quality control. Data acquisition and analysis as the basis for corrections is this company's method for improving yields.
New Architecture Brings Test, Assembly Challenges
TORONTO — Computer servers and workstations are more complex than everyday consumer electronics. Throw in a new processor architecture, Intel's Itanium Processor Family (IPF), and things get even more interesting.
Currently, there are approximately 12 different processor architectures used, but OEMs are moving toward the more standardized IPF format. With companies transitioning to the new architecture, they will have to keep design and manufacturing teams and technologies for both products with the old architecture and those with the new, according to Myke Predko, advisory engineer for Celestica Inc., who presented a paper on IPF at SMTA International in September.
But that's just the tip of the iceberg. "The Itanium 2 socket, which is a PGA-to-BGA socket, is designed so that processors can be put on two sides of a PCB," Predko explained. "That is a very difficult process to get working. That's something EMS providers are going to have to invest in."
Additionally, Itanium 2 and Itanium 3 (the next version) each dissipate 130 W of heat.
From the test perspective, Celestica is working on a standard set of tests that OEMs or EMS companies could use to build the product. Coming up with a standardized test will reduce costs and make IPF more attractive to these companies, Predko said.
Blades, popular single, "1U" or 1.75" servers can be stacked. Challenges include providing adequate cooling for the final product, as well as the EMS trying to simulate this environment and provide adequate cooling.
A final challenge involves the front side bus. Intel recommends that the processor be placed on a separate board with the CPU support chips.
According to Predko's SMTA International paper, the benefits are present as well as the challenges. IPF will help make servers and workstations more cost-effective and standardized for high-end users, and eventually will reduce manufacturer cost.