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Product Review
December 31, 1969 |Estimated reading time: 19 minutes
EQUIPMENT
BGA/SMT Rework SystemChipmaster-Z SMD-1000-Z BGA/SMT rework system is said to offer an electric Z-axis, which provides clearance for its hot air nozzles, thus avoiding obstructive components of awkward height. The rework system is said to automate the Z-axis adjustment and assist the user in clearing the area after rework. It also helps access the component without concern of surrounding obstruction. The lead-free compliant, CE-certified benchtop unit is said to use controlled directed, heated air via a 1,200 W heater and interchangeable nozzles to remove, align and replace BGAs, SMDs, connectors and other devices, reportedly without PCBA damage. A.P.E., Key Largo, Fla.
COMPONENTS
Vertical Female ConnectorsThe 8072 Series of 2 mm hard metric vertical female connectors reportedly are for backplane applications, and comply with international standard IEC 61076-4-101. The connectors are said to eliminate the possibility of bent pins when used in place of male connectors in backplane applications. Press-fit contacts also are provided for a gas-tight connection. AVX Corp., Connector Div., Myrtle Beach, S.C.
MATERIALS
Conformal CoatingEccocoat UV 7993 one-component, solventless UV light and moisture cure conformal coating is urethane-based and reportedly offers chemical and moisture resistance, mechanical toughness and a resilience that minimizes potential component stress. This coating reportedly emerges tack-free within 5 to 7 seconds after UV exposure, and "shadow" cure areas that may not be reached directly by the UV finish cross-linking at room temperature. This dual cure system can be applied anywhere from 0.001 to 0.040" thick. Emerson & Cuming, Billerica, Mass.
CONTRACT SERVICES
Contract Inspection ServicesThe company offers contract inspection services using its X-ray inspection equipment, expertise and technology. The service reportedly gives manufacturers of SMT boards, semiconductor components and PCBs the flexibility of offloading nondestructive testing and assembly inspections using X-ray equipment. This option is said to allow customers the benefits of X-ray inspection without purchasing a machine. phoenix|x-ray Systems + Services Inc., Camarillo, Calif. For free data, circle 203 or visit www.onlinecenter.to/smt.
SOFTWARE
Scientific/Industrial Imaging SoftwareInspector 3.1 is a Microsoft Windows application for image capture, processing, analysis, display and archiving. Based on the company's Imaging Library software development tool kit, this software reportedly provides point-and-click access to an extensive set of optimized functions for image processing, blob analysis, gauging and measurement, as well as pattern matching. Features are said to include easy-to-use interactive tools for OCR, bar and matrix code recognition, and watershed-based image segmentation. Matrox Imaging, Dorval, Quebec, Canada.
EQUIPMENT
Precision Rework StationX-1 precision rework station reportedly is a flexible system designed for manual alignment and placement or removal of surface mount electronic components with precisely controlled solder reflow profiles. The system also features a gantry style construction similar to that of a pick-and-place machine, allowing the ..board to remain stationary while the head moves to accomplish the X, Y, Z and Q alignment. The design is said to allow a larger board capacity in a smaller footprint with board fixturing, stationary bottom-side support, a large preheater, and a top and bottom board clearance. Precision Manufacturing Tools, A Prodev Inc. Div., Newburyport, Mass.
Inspection SystemS3043 QuickScan inspection system reportedly is designed to handle the majority of standard assembly inspection needs, including recognition of the fault characteristics for paste print, components and wave soldering. This product family is targeted for use in ..industrial assembly applications, and is equipped with simplified sensors. The heart of the system is a high-resolution line camera with high-scanning frequency. The sensor circuitry with software-controlled LED line illumination is said to form the basis for high-image quality and stable evaluation, while simultaneously guaranteeing high speed. Viscom USA, Atlanta, Ga.
Chip PlacersCP-742E and CP-742ME chip placers support 140 and 80 component types, respectively. Features include batch feeder replacement and power saving mode, two CCD cameras used to process different parts, a high-resolution narrow view camera for smaller components and small SOTs, and a wide view camera for SOICs, PLCCs and CSPs. The ability to switch between front and back lighting is said to ensure optimal part outlines. Fuji Machine Mfg. Co. Ltd., Aichi-ken, Japan.
Stencil PrinterMPM AccuFlex stencil printer is targeted for use by manufacturers producing approximately 8,000 boards per week, with two or more product changeovers per shift. The printer reportedly handles boards from 3 x 2" to 23 x 20", and is capable of printing 0.012" pitch devices ..with consistent accuracy. A "high-performance" option is said to reduce the printer's cycle time by as much as 5 seconds, and a triple-track conveyor system with 3 mm bottom-side edge clearance facilitates both board flow and integration flexibility. Several other options, such as automatic board support pin placement and programmable stencil positioning, are said to reduce or eliminate operator intervention during changeovers. Speedline Technologies Inc., Franklin, Mass.
Test and Inspection SystemThe microfocus X-ray .20 series has been redesigned with improved X-ray tube and imaging chain technologies. The standard features of the series still include an ergonomic console for optimized inspection settings, an ultra-high precision tilt and rotate manipulator system, real-time measurement capabilities, and multiple fields of view. Some new features reportedly include the latest X-ray imaging capabilities, and more imaging chain choices such as the direct digital X-ray detector (DDD). FeinFocus USA Inc., Stamford, Conn.
Final Assembly InspectionK2-AOI is a large-format color imaging system that reportedly features 16 million colors and 6 million pixel sensors. This system is said to measure component features, even on 0201s, capturing far more accurate and reliable data. The system also features an Adaptive Resolution strategy that allows sub-mil extraction. Additionally, the large maximum image size of 4 x 4" allows fast throughput. Vectron Inc., San Diego, Calif.
Solder Inspection SystemVT-WIN II PCB solder inspection system can be used either in-line or off-line for rapid, accurate identification of various circuit board assembly defects. Its zoom lens reportedly allows multiple magnifications down to 10 µm per pixel. The system is said to have advanced algorithms that enable proper inspection of leading technology processes, such as lead-free solder. The system's software, which is programmed via CAD placement data, also incorporates intelligent algorithms to reduce operator-programming time. Omron Electronics LLC, Schaumburg, Ill.
IR Screening SystemISIS 7070 in-line infrared circuit verification system is said to enhance PCB assembly. By positioning the system after reflow, manufacturers reportedly can verify board integrity prior to functional testing, while at the same time isolating processing problems so that ..corrective action can be taken before defective boards accumulate. The screening system uses an infrared camera that detects heat dissipated by electronic assemblies that have been electrically powered. A defect can cause areas of the board to radiate either too much or too little heat. The system compares these areas to a statistical model and determines that the board has either passed or failed. ART Advanced Research Technologies Inc., Saint-Laurent, Canada.
Modular Chip MounterCM402L modular chip mounter reportedly can produce 60,000 cph. The mounter features a flexible design and includes a cart for changing over all feeders at once, as well as external board support pin setup. Additionally, the chip mounter can be reconfigured from high-speed to multi-function head on-site, and also is said to use five types of programmable pitch tape feeders from 8 to 72 mm. Panasonic Factory Automation Co., Franklin Park, Ill.
Cleaning SystemMega II's closed-loop solvent (or water) electronic assembly and parts cleaning system with quantitative ION detection and SPC capability reportedly is targeted for use in flip chip, optoelectronics, and advanced or high-reliability technology packages and assemblies. The system's wash and rinse cycles are said to incorporate a spray under immersion process, with strategically located venturi nozzles. The agitation can be controlled to handle sensitive wire bonded substrates or tight tolerance flip chip technology. An ultrasonics assist is said to be available as an option for tough cleaning requirements. Austin American Technology Corp., Austin, Texas.
Component MounterRelease 2 of the Topaz-XII component mounter reportedly features a new camera, enabling it to place larger components up to 45 mm2 and 11 mm in height. The mounter is said to be capable of handling boards measuring up to 550 x 610 mm. The existing Windows NT-..based graphical user interface includes new operator functionalities, including the capability to optimize a production program while the machine is running, as well as edit the programs during operation. Assembléon, Eindhoven, The Netherlands.
Fine-pitch AssemblerKE-2040 fine pitch assembler is for high-speed placement of odd-shaped and fine-pitch components, and is manufactured with two high-precision placement heads that can be outfitted with an assortment of vacuum pick nozzles. The assembler's emphasis on modularity is said to allow it to integrate into any line that produces high-mix boards containing odd-shaped components. The company's 30-second changeover time is said to make this integration fast and reliable. Juki Automation Systems Inc., Morrisville, N.C.
Universal Tooling PinThe Universal Tooling Pin is a patented pin option designed for semiautomatic screen printing applications. The pin features a unique design, which registers PCBs, regardless of the tooling hole size. The pin reportedly is manufactured of heavy-duty stainless steel while incorporating built-in screws to eliminate the possibility of board movement. Production Solutions Inc., Poway, Calif.
Programmable Semiautomatic PrinterThe optional vision system SP100-VIS improves the repeatability of the printing quality on the programmable printer SP100. The vision system reportedly ..measures the deviation and calculates the required movements, and the operator is guided to do the correction, allowing for fast and easy alignment. The system's two cameras look straight through the stencil onto the circuit; therefore, the position is checked and corrected just before printing. Up to 99 different processes are said to be programmed and stored, providing reproducible printing when production lots are small and changeover frequency is high. ESSEMTEC AG, Aesch, Switzerland.
Dispensing RobotsThe 2000 Series of high-capacity dispensing robots have been designed to take up as little space on a bench as possible, yet be used in 24/7 operation. The robots reportedly are easy to program with step-by-step instructions. Models are said to be available with working areas from 8 x 8" to 16 x 16". The robots also automate any industrial sealing, gasket, potting or filling application, together with sampling and vial fill automation in laboratory environments. Each robot is equipped with a basic tooling plate and dispensing fixture. I&J Fisnar Inc., Fair Lawn, N.J.
AOI SystemVi-5000 AOI system reportedly offers 100 percent inspection of boards up to 457 x 508 mm at speeds up to 250,000 cph. The inspection system is said to verify component positioning (X, Y and Q), polarity, text and presence/absence; inspects solder paste and joints; and ..detects bridges. The system's granite Y-axis reportedly is unaffected by changes in factory temperature, allowing accuracy of 5 µm at six sigma. The system also is equipped with a high-quality camera lens with a large field of view that prevents component image distortion. Additionally, improved linear motors and closed-loop optical encoders provide repeatability of 2 µm. ViTechnology LLC, Haverhill, Mass.
In-line Stencil PrinterE5-36 is a large format in-line stencil printer that features a print area of 36 x 24". The automatic printer offers other features such as a patented vision alignment system with software-controlled variable lighting technology, 2 1/2D post-print inspection and vacuum stencil wiping. When processing large PCBs, these features, combined with a heavy-duty transport system, reportedly allow for the same repeatability and robustness performance levels as when printing smaller substrates. EKRA America, Marlborough, Mass.
Post-solder Inspection SystemOptima 7300-EP post-solder inspection system is used at both the post-reflow and post-wavesolder steps to inspect PCBAs for the full range of component, solder and assembly faults. Using five independent cameras and structured light, the system reportedly collects defect images from multiple vantage points on the fly to isolate and detect defects. The system features an improved fiducial illumination system, an operator interlock system, higher inspection rates and a new staged conveyor. Teradyne Inc., Boston, Mass.
Dispensing SystemAxiom X-1020 mid-range in-line dispensing system is for semiconductor package and PCB assembly. The system uses a Controller Area Network (CAN) bus, a new serial bus architecture of distributed processors. A processor mounted directly on the dispense head reportedly controls the valve, needle heater, height sensor, lighting and associated I/O. A second controller is said to manage all conveyor-related functions including the width and belt motors, substrate heaters, all conveyor sensors, and pneumatic actuators, as well as the SMEMA interface. Applications include flip chip and CSP underfill, dam-and-fill, solder paste, thermal compounds, and more. Asymtek, Carlsbad, Calif.
COMPONENTS
ArraysCHC Series arrays in BGAs feature power ratings from 0.5 W (in the 0865 package) to 1.6 W (in the 1065 ..package), and are targeted for use in portable products and high-speed switches. The construction of these chip scale termination arrays features eutectic solder bumps on a ceramic substrate, which is said to deliver devices with low parasitic inductance and capacitance values. This construction reportedly leads to a reduced ground bounce, improved speeds and more consistent propagation delays. International Resistive Co. Inc., Advanced Film Div., TT electronics plc, Corpus Christi, Texas.
Diode ArraysThe SP05xC family of transient voltage suppressor (TVS) avalanche diode arrays in a CSP are designed to protect analog and digital signal lines from ESD transients. Some features of the series include a small footprint, ..low-capacitance of 39 pF, clamping voltage of 12 V, low leakage current and a sub-nanosecond response time. The series also reportedly can sustain ESD of 18 kV per IEC standard, and 30 kV per the Human Body Model (HBM). Littelfuse Inc., Des Plaines, Ill.
IGBTsSMPS II IGBTs are designed to replace 500/600 V MOSFETS in SMPS, PFC and other high-power applications without redesign of the gate drive voltage circuitry. ..The component's gate drive voltage requirement has been reduced to 8 to 10 V, similar to a MOSFET, allowing larger die size power MOSFETs or multiple MOSFETs in parallel to be replaced with a single SMPS II IGBT. The IGBT technology is said to improve power density, system efficiency and reliability, and enable operation to 150 kHz without current de-rating. Conduction losses are said to be lower, especially at high temperatures, and gate charge is reduced by 80 percent. Fairchild Semiconductor International, San Jose, Calif.
MOSFET DriversSi9912 and Si9913 half-bridge MOSFET drivers are optimized for single-input, high-frequency switching in DC/DC converters. By offloading the power MOSFET drive requirement from the controller IC, the devices reportedly increase system design flexibility for various power conversion designs used in desktop and notebook computers, computer peripheral products, and consumer electronics products. The drivers offer an extended input voltage range of 4.5 to 30.0 V, with a supply voltage of 4.5 to 5.5 V. Siliconix, a Vishay Intertechnology Inc. Co., Malvern, Pa.
Ceramic AntennasExtended miniature surface mount ceramic antennas now include types optimized for 433 and 870 MHz operations. The 433 MHz version measures 37.5 x 6.8 x 0.9 mm while the 870 MHz version measures 16.5 x 14 x 0.9 mm. Both antenna versions are manufactured using low-temperature co-fired ceramic and also by using the company's proprietary non-toxic water-based production process with lead-free terminations. Yageo Corp., El Paso, Texas.
MATERIALS
Solder Reflow EncapsulantHYSOL FP4470 is a low-viscosity, high-flow, self-leveling fill material that flows quickly, penetrating and covering fine-pitched wires. The encapsulant reportedly is designed to withstand 260ºC peak solder reflow temperatures without degradation, and also is formulated to offer low ionic content for good corrosion resistance and to protect large semiconductor devices or devices using lead-free solder. Frozen storage is required at approximately -40ºC for maximum shelf life and recommended cure time is 30 minutes at 125ºC plus 90 minutes at 165ºC. Henkel Loctite Corp., Rocky Hill, Conn.
Epoxy AdhesiveEPO-TEK H20E epoxy adhesive can achieve a thermal conductivity of 29 W/mºK. This high thermal conductivity is expected to be of particular benefit to manufacturers who produce high-density packages and other high-power generating applications. The epoxy reportedly is compatible with numerous substrates such as FR4, ceramics, lead frames and flex substrates, including Kapton, Mylar and polyester. Epoxy Technology Inc., Billerica, Mass.
Conductive Adhesives/Potting CompoundsSyon electrically conductive adhesives/potting compounds reportedly can be used to form conductive paths in applications in which hot soldering would be ineffective or impractical. The materials are said to ..offer thermal conductivity and can bond or seal electrical components or wiring in applications requiring heat dissipation. These low-shrink, nonshrink epoxy and epoxide formulations also mix and pour easily, fill voids completely, and cure with minimal air entrapment. Devcon, Danvers, Mass.
Solder PastePrintPlus 477 water-soluble solder paste is said to provide results with enclosed print heads. The heads reportedly offer faster printing and higher print reliability with less waste than standard squeegee printers. ..The paste's formulation is said to withstand the sustained pressure and repeated pressurizations encountered with enclosed print heads, giving manufacturers the option of increasing output, improving quality and decreasing cost by switching from conventional stencil printing to enclosed print heads. EFD Inc., East Providence, R.I.
No-clean Solder PasteA no-clean solder paste made with synthetic poly adducts, SynTECH reportedly yields reliable solder joints in PCB assemblies. The paste offers up to 18 hours of stencil life and is said to be ideal for fine-pitch solder joint ICT. It remains soft and pliable, enabling test probes to pass through flux into the solder joint without clogging the probe. Additionally, the paste ..reportedly works with all lead-free formulations including tin/silver copper alloys, without compromising SIR values. AMTECH Inc., Branford, Conn.
SpheresEcóspheres are for use in BGA and CSP applications, and are produced using the company's patented process and specially formulated solder paste. The spheres are formed between 0.006 and 0.030" in diameter within tightly controlled tolerances. The spheres also are available in lead-free configurations. Mask Technology Inc., Santa Ana, Calif.
Flip Chip Bump AlloyLF-2 lead-free Sn/Ag/Cu alloy achieves alpha emissions of less than 0.0002 particles/hour/cm2, and is said to demonstrate increased reliability and enhanced effectiveness of the under bump metallurgy (UBM) during high-temperature storage (HTS), high-temperature operating life (HTOL), die shear and aging tests. The HTOL test further demonstrates electromigration improved more than 3.7 times vs. 63Sn/Pb and more than four times compared to Sn/Ag plated bumps. Kulicke & Soffa Industries Inc., Willow Grove, Pa.
AdhesiveType 6 high-temperature stencil adhesive is for joining foil to polyester mesh on Etch Guard stencils. The raw materials in the adhesive reportedly are designed to withstand newer cleaning chemistries and environments. The adhesive is said to be available on both chemically etched and laser-cut stencils. MicroScreen, South Bend, Ind.
In-line Fluxing SystemOpti-Flux II spray fluxing system features automated, in-line selective fluxing, allowing the operator to flux selected areas of the board or pallet fixture. The system is said to identify the board type by the bar code automatically, which is associated with a recipe previously entered into the menu by the operator. Setup reportedly is programmed easily through PC-based software. The spray uses a solid, vibrating, titanium surface rather than a nozzle to atomize the flux. Ultrasonic Systems Inc., Amesbury, Mass.
Solder PasteNC-SMQ81 Sn/Bi/Ag alloy solder paste is a no-clean, halide-free solder paste designed for thermally sensitive assembly processes using the eutectic Sn/Bi/Ag alloy. ..The paste is a moderate residue, air reflow product that is said to feature exceptional wetting capabilities, ensuring high yields in soldering. The solder paste reportedly is made from low-oxide, spherical powder composed of Sn/Bi/Ag and other low-temperature alloys. A standard mesh size of -325/500 is available, and nonstandard mesh sizes including -400/635 can be supplied upon request. Indium Corp. of America, Utica, N.Y.
CONTRACT SERVICES
Optical Materials Testing ServicesThis company offers test services for optical properties of clear epoxies and encapsulants. Reportedly, a series of standardized tests for optical transmission, thermo-optic coefficients, and refractive index vs. wavelength and temperature have been developed. Price is per sample, with discounts for multiple samples. Curing and preparation of samples is included; turnaround time is one to three weeks with 48-hour rush services available. The test data may be used for troubleshooting suspect lots of material, design qualification of materials for design performance and lot sample materials for ongoing production quality control. Fiber Optic Center Inc., New Bedford, Mass.
Custom Coating ServicesThe company's custom coating segment reportedly provides OEMs, converters and suppliers with turnkey coating services, incorporating customized adhesive development. The company reportedly introduced this contracted service to serve as a value-added partnership; customers can reduce overall costs and reportedly leverage the company's expertise in adhesives and coating. By turning the coating process, time- and resource-intensive by nature, over to the company's experts, customers reportedly can gain efficiencies by way of maximized throughput and decreased turnaround time. Tyco Adhesives, Norwood, Mass.
Electronics Manufacturing ServicesThis manufacturer of rack-mounted computers and rack system offers electronics manufacturing services (EMS) on a contract basis to OEMs, making its ..design and manufacturing facility available for product design, development, fabrication and PCB assembly. For products that already have been designed, the company reportedly can accept essentially any CAD format for direct input into its surface mounting and PCB assembly equipment line. Crystal Group Inc., Hiawatha, Iowa.
Conformal Coating ServicesHumiSeal conformal coating services are said to protect virtually any printed circuit assembly from contamination. These conformal coatings reportedly provide a secure envelope around a circuit board and its components, and act as a barrier against moisture, fungus, dust and other environmental contaminants. When the coatings are applied properly, they also can enhance circuit reliability by eliminating detrimental conditions such as leakage from high-impedance circuits, and allowing closer circuit traces required with high component density. Chase EMS Group, West Bridgewater, Mass.
SOFTWARE
Programming and Optimization SoftwareDimensions Programming and Optimization (DPO) software provides balancing, optimization and program generation for the company's surface mount assembly lines. DPO software reportedly provides one ..point of data entry, a common interface across machine types, and a consistent process to generate production and setup data for one or more assembly lines, with any combination of GSM platforms, HSP machines or single machines. Universal Instruments Corp., Binghamton, N.Y.
Frame Grabber SoftwareLeutron Vision Software Development Suite (LV-SDS) revision 1.93 controls the Vision frame grabber family. As part of this update, the software features Orchid, a simplified library based on COM technology that facilitates the development of applications under MS ..Visual Basic and all COM-compatible software. Orchid also may be accessed with regular C/C++ function calls. The revised Camera Editor tool is said to offer more control on the asynchronous reset parameters when defining a camera connected to a frame grabber. Leutrek Vision Inc., Burlington, Mass.
Line-balancing SoftwareMYSpeed 2.4 optimization and line-balancing software reportedly offers an optimal kitting solution to maximize throughput, and allows production schedules to be planned accurately. With intuitive tools to assist the operator, instructions reportedly can be printed out, and balancing can be optimized. Functions include a new wizard for defining machines, a quick quoting process editor, more streamlined job preparation, and printed instructions and results. MYDATA automation Inc., Rowley, Mass.
OCR SoftwareThis software is combined with optical character recognition (OCR) capabilities, allowing verification of correct part numbers or inspection of wrong components. The software is said to include SPC capabilities with a new concentration diagram that graphically represents the increasing frequency of defects. This allows real-time indication of recurring defects so corrective action can be taken. Reportedly, one of the new options includes an improved parts generation function, which makes programming easier and faster. Machine Vision Products Inc., Carlsbad, Calif.
Software LibrarySapera 4.1 is an enhanced software library for high-performance image acquisition, processing and analysis. This software reportedly incorporates a number of added support features that speed the application development process. The software includes the SMART series, a collection of robust application-specific libraries for pattern matching (SMART search), OCR (SMART OCR) and 1-D/2-D bar codes (SMART Matrix). Coreco Imaging, Montreal, Quebec, Canada.
Machine Vision SoftwareIMAQ Vision 6.0 machine vision software allows users to create integrated visual inspection applications with ..Measurement Studio, a complete software package that is said to deliver measurement tools including data acquisition, data analysis and data visualization to complement Microsoft Visual Basic, Visual C++ and ANSI C programming languages. With the new features of this version, users can solve applications that require color inspection and high-accuracy gauging. National Instruments, Austin, Texas.