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SMTA Boston Flip Chip and BGA Workshop Issues Call for Presentations
November 27, 2002 |Estimated reading time: 1 minute
Minneapolis -- Under the direction of SMTA Vice President of Technical Programs Ken Gilleo, Ph.D., Cookson Performance Solutions, and Conference Chairman Paul T. Vianco, Ph.D., Sandia National Labs, the SMTA is organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference, taking place June 9 through 11, 2003, at the Bayside Convention Center in Boston.
The Flip Chip and BGA Packaging Technologies Workshop will focus on three topics, Assembly Processes for Flip Chip and BGA, Materials Systems for Area Array Packaging, and Reliability of Flip Chip and BGA Packages and Interconnects. Presentations, rather than papers, are being sought for the workshop format to allow more time for interaction, questions and answers.
The workshop session for each topic will begin with an overview followed by detailed presentations, which describe state-of-the-art technology and future trends. Presentations based upon laboratory research and development studies, actual product applications, as well as failure analysis case studies will be featured in this event.
Presentation abstracts of 200 to 300 words are being accepted until January 15, 2003.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations. For more information, visit www.smta.org.