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IPC Honors Best Technical Paper at 2002 IPC Annual Meeting
November 15, 2002 |Estimated reading time: Less than a minute
Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries(r) has announced the winner of the Best Technical Paper Award at the 2002 IPC Annual Meeting, which took place November 3 through 7 in New Orleans, La.
Steven Dunford, Nokia Mobile Phones; Anthony Primavera, Ph.D., Universal Instruments Corp.; and Michael Meilunas, Universal Instruments Corp., received the Best Technical Paper Award for their paper entitled "Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 degrees C to 125 degrees C Thermal Cycles." The paper was chosen based on its timely insight into the effects of long-term thermal mechanical stresses and the attendant failure mechanisms in Pb-free solder interconnections.
IPC awarded the recipients with a commemorative plaque at a luncheon award ceremony on Wednesday, November 6.IPC is a U.S.-based trade association dedicated to the competitive excellence and financial success of its more than 2,600 member companies, which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. For more information, visit www.ipc.org.