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Members Honored at IPC Annual Meeting
November 14, 2002 |Estimated reading time: 4 minutes
Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries(r) honored 66 members at the 2002 IPC Annual Meeting, held November 3 through 7 in New Orleans, La., for their contributions to IPC and the electronics interconnect industry.
Aroon Tungare, Ph.D., Motorola, was honored with the IPC President's Award, which is given to members who have exhibited ongoing leadership in IPC and have made significant contributions to the association and the electronics interconnect industry. Tungare was awarded for his significant efforts as member and past chairman of the IPC Printed Circuits Expo Technical Program Committee and active participation in the Long Range Planning Committee and numerous standards committees.
IPC also presented seven Special Recognition Awards, which are presented to individuals who have made a recent exceptional contribution to an IPC program. The following were honored at this year's IPC Annual Meeting:
- Thomas G. Farrell, Underwriters Labs, for his completion of the silver migration test requirement revision in UL796.
- Donald P. Cullen, MacDermid Inc., for his leadership of the ad hoc IPC group that revised the silver migration test requirement in UL796.
- Blen F. Talbot, L-3 Communications, and Sharon T. Ventress, U.S. Army Aviation and Missile Command, for their leadership of IPC-HDBK-610 Task Group 7-31g.
- William Kenyon, Ph.D., Global Centre for Process Change Inc., for his significant leadership in the release of IPC-SA-61A, Post Solder Semi-Aqueous Cleaning Handbook.
- Sharon Goudie, Dow Corning Corp., and Fonda Wu, Raytheon Electronic Systems, for their extraordinary efforts and dedication as co-chairs of the IPC-HDBK-830 conformal coating handbook task group.
IPC also presented 58 Distinguished Committee Service Awards at the 2002 IPC Annual Meeting. This award is given to IPC committee members who have made an exceptional contribution to a specific standard, guideline, round robin test program or other IPC program.
The following individuals were awarded for their significant efforts in the release of the ANSI-approved IPC-4412, Specification for Finished Fabric Woven from "E" Glass for Printed Boards:
- Mike Bryant, BGF Industries
- Robert J. Konsowitz, GIL Technologies
- P. Douglas Lyle, Advanced Glassfiber Yarns
- Joel Murray
- Marco Scari, Giuidi USA
The following 13 individuals were also awarded Distinguished Committee Service Awards for their efforts in the release of IPC-HDBK-830, Guideline for Design, Selection and Application of Conformal Coatings:
- Alan Brewin, Electronics Interconnection Group
- Amelia DeBaggis, Honeywell Inc.
- Dave Douthit, LoCan LLC
- Roger Landolt, Cookson Electronics
- James Maguire, Intel Corp.
- Randy McNutt, Northrop Grumman
- Graham Naisbitt, Concoat Ltd.
- Doug Pauls, Rockwell Collins
- Barry Ritchie, Dow Corning Corp.
- Erik Tegehall, IVF
- Brian Toleno, Henkel Loctite Corp.
- John Waryold, Humiseal Division/Chase Corp.
- Lamar Young, Specialty Coating Systems Inc.
The following individuals were honored for their contributions toward the release of IPC-2252, Design Guide for RF/Microwave Circuit Boards:
- Ted Edwards, Dynaco Corp.
- Nicholas G. Paulter, NIST
- Lowell Sherman, Defense Supply Center Columbus
- G. Robert Traut, Rogers Corp.
For their support in the development of IPC-HDBK-610, Handbook and Guide to IPC-A-610, the following 16 members were also awarded the IPC Distinguished Committee Service Award:
- William G. Butman, AssemTech Skills Training Corp.
- Jennifer Day, Current Circuits
- Kathy Edsinger, Plexus Corp.
- Daniel L. Foster, Soldering Technology International
- Fortunata A. Freeman, Solectron Technology Corp.
- Hue T. Green, Lockheed Martin Space Systems
- Michael R. Green, Lockheed Martin Space Systems
- Frank Honyotski, Soldering Technology International
- Greg Hurst, BAE Systems
- James H. Moffitt, Moffit Consulting Services
- Ken A. Moore, OMNI Training Corp.
- Gregg Owens, MTTC
- Teresa M. Rowe, AAI Corp.
- Patricia A. Scott, Soldering Technology International
- Ge Wang, TRW Electronics and Technology Division
- Robert Zimmermann, NASA
The following individuals were honored for their significant efforts in the release of IPC-9151, Printed Board Process, Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database:
- Bob F. Boggio, Jr., ITN Technology Corp.
- Gary Hoeppel, Coretec Inc.
- Gary B. Long, Intel Corp.
- Greg Lucas, Topsearch
- Daryl A. Sato, Intel Corp.
- Rick B. Snyder, Delphi Delco Electronics Systems
For contribution to the development of the Training Recertification Program for IPC-7711, Rework of Electronic Assemblies, and IPC-7721, Repair and Modification of Printed Boards and Electronic Assemblies:
- Jeff Ferry, Circuit Technology Center
- Daniel L. Foster, Soldering Technology International
- Fortunata A. Freeman, Solectron Technology Corp.
- John Mastorides, Sypris Electronics
- Teresa M. Rowe, AAI Corp.
IPC also honored the following eight members with the IPC Distinguished Committee Service Award for their significant efforts in the release of the ANSI-approved IPC-4202, Flexible Base Dielectrics for Use in Flexible Printed Circuitry; IPC-4203, Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films; and IPC-4204, Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry:
- Lawrence Dexter, Advanced Circuit Technology
- Joseph DiPalermo, M-Flex/PICA Sales and Engineering
- Thomas Fisher and Thomas Gardeski, DuPont Co.
- Russell Griffith, Parlex Corp.
- Duane Mahnke, Rogers Corp.
- Ross Neu, DuPont Technologies
- Clark F. Webster, All Flex Inc.
In addition, Terry Munson, CSL Inc., was awarded a Distinguished Committee Service Awards for his leadership as immediate past chairman of the 5-32a Ionic Conductivity/Ion Chromatography Test Task Group responsible for the release of IPC-TR-583, An In-Depth Look at Ionic Cleanliness Testing.
IPC is a U.S.-based trade association dedicated to the competitive excellence and financial success of its more than 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. For more information, visit www.ipc.org.