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IPC Issues Call for Papers for 'Flex and Chips' Conference
October 22, 2002 |Estimated reading time: 1 minute
Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries(r) announces a call for papers for its International Symposium on Flexible Circuits and Chip Scale Packaging (CSP), which takes place February 10 through 12, 2003, at the Fiesta Inn in Tempe, Ariz.
Selected papers will be presented at the International Symposium on Flexible Circuits and CSP and published in the technical proceedings. Papers are being sought from the following areas:
- Design for CSPs using flex
- Flex materials for CSP use
- Flex HDI for CSP applications
- Three-dimensional CSPs
- Yields with flex and CSPs
- Non-CSP flex applications
- Market trends for flex
- Flex processing innovations
- Flex circuits assembly
- Flex test and reliability
- CSP die attachment
- CSP design
- CSP standards progress
- Wafer-level fabrication
- CSP solder joint reliability
Paper presentations should be 30 to 60 minutes in length, non-commercial in nature and summarize the problems and resolutions, methods used, results, and benefits to the industry. Papers focused on a company's products will not be accepted.
Abstracts of the unpublished work detailing case histories, field data, new technologies or innovations, or research and findings must be received by Wednesday, November 20, 2002. Each abstract should be approximately 200 to 300 words in length and include a biography.
IPC is a U.S.-based trade association dedicated to the competitive excellence and financial success of its more than 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. For more information, visit www.ipc.org.