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IPC Exclusive Report Examines New Connector Applications' Effect on Industry
October 8, 2002 |Estimated reading time: 1 minute
Northbrook, Ill. -- IPC -- Association Connecting Electronics Industries(r) introduces "The Impact of Emerging Connector Designs on Printed Circuit Design and Fabrication," a recently commissioned report from Prismark Partners LLC, a leading electronics industry consulting firm.
The 31-page report presents the findings from Prismark Partners' research on the impact emerging connector applications will have on the design and fabrication of printed circuit boards and an insight into the potential need for new board geometries, materials and constructions.
The report divides and analyzes five connector applications groups: 1) signals within network systems, 2) signals from network systems, 3) power to and within network systems, 4) connectors in high reliability systems and 5) connectors in handheld systems. The three network systems segments include data communications, telecommunications, servers and data storage.
In its research, Prismark Partners conducted interviews with designers and product engineers in all five of the aforementioned groups from such companies as Cisco Systems Inc., Lucent Technologies, Nortel Networks, Sun Microsystems, Motorola Inc., Juniper Networks Inc., Alcatel, Fujitsu, Delphi, TRW Inc., Nokia, 3Com Corp., and Teradyne Inc.
The interviews produced the following insights and discussion points, which Prismark Partners captures in its report:
- A description of today's leading-edge connectors
- The necessary board geometries to accommodate new connectors
- The board materials and constructions specifically driven by use of connectors
- Major upcoming forces that are driving the use of new connectors
- The design of new connectors, including pitch and through hole/surface mount
- The board implications, such as line width, hole size, layer count and materials
- Implementation timing
The data is also aggregated into a series of roadmaps for four major application areas: network systems, portable systems, high reliability systems and special applications. The roadmaps show the anticipated timing and technology of how connector changes will impact board design and fabrication.
IPC will be presenting these roadmaps at the Fall Technology Market Research Council Meeting, taking place November 5 through 6, 2002, at the Hyatt Regency in New Orleans, La., in conjunction with the 2002 IPC Annual Meeting.
IPC is a U.S.-based trade association dedicated to the competitive excellence and financial success of its more than 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. For more information, visit www.ipc.org.