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Conference Program Complements New NEPCON West/Assembly West/Fiberoptic Automation Expo Co-Location
October 9, 2002 |Estimated reading time: 1 minute
San Jose, Calif. -- The NEPCON West, Assembly West and Fiberoptic Automation Expo 2002 Conference will feature state-of-the-art education developed specifically for manufacturing professionals by several of their most respected industry associations including the SMTA and the SME.
The conference is held concurrently with the NEPCON West, Assembly West and Fiberoptic Automation Expo co-located trade event, which will take place December 4 through 6, 2002, at the San Jose McEnery Convention Center. The conference commences one day earlier on December 3rd.
The Surface Mount Technology Association (SMTA) will continue its association with the NEPCON events by producing the NEPCON West conference program. The SMTA will also lend its expertise this year by organizing the Fiberoptic Automation Expo conference program.
The NEPCON program will consist of 15 full and half-day tutorials and 24 technical sessions for today's electronics business and manufacturing environment. Topics will include: Business Issues and New Strategies; Optimizing Relationships in the Global Economy; Test & Inspection for Extreme Density and High Speed; Packaging & Assembly -- 0201, Flip Chip, CSP and 3D; Design for Manufacturability; Green and Lean -- Halo-Free, Lead-Free and Solder-Free; Flexible Circuitry; Wireless Revolution, WiFi, Bluetooth; and more.
The American Society of Test Engineers will present two courses as part of the NEPCON West program. "Microsoft.net and Its Implications for Test" will be presented as a panel discussion and "PXI and Test-Architecture and Applications" will be part of the technical program.
The Fiberoptic Conference program will provide attendees a chance to explore with experts on how to increase yields and lower costs in the real world. The program consists of seven full and half-day tutorials and ten technical sessions. Topics to be covered include: NEMI Roadmap, Optoelectronics in Transition, Automation for Cost-Reduction and Quality Improvement, Cost-Reduction Strategies, The Role of Optical MEMS, Packaging Issues, Nanotechnology in Optoelectronics, and High-speed Achieved Through Optoelectronics.
The International Institute of Connector & Interconnection Technology (IICIT) will also participate in the Fiberoptic program by offering "The Fundamentals of Fiber Interconnection."
For the third year, the Society of Manufacturing Engineers (SME) and the Edison Welding Institute (EWI) will again organize sessions in the Assembly West conference program. Courses will focus on a variety of high-interest topics including: Work Cell Design, Design for Assembly, Aerospace Electronics, LeanSigma, Failure Mode Effect and analysis, Small Scale Resistance Welding, and Robotics. Eleven full and half-day tutorials and five technical sessions will be offered.
For more information, visit www.nepconwest.com.