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IMAPS Announces 'Ceramic Interconnect Technology: The Next Generation' 2003 Conference
September 24, 2002 |Estimated reading time: 1 minute
Sponsored by IMAPS and the Ceramic Interconnect Initiative, and endorsed by the American Ceramic Society, this expanded 2003 Conference on Ceramic Interconnect Technology will explore leading-edge issues in ceramic interconnect technology, which has a long history of meeting the requirements of the most demanding applications. The organizing chairs have selected a worldwide panel of industry experts to chair sessions for this conference. They and their planned sessions include the following:
- Design, Simulation & Modeling: John Gipprich, Northrop Grumman
- Power and Thermal Management: Kinzy Jones, Ph.D., Florida International University
- Portable Wireless & Bluetooth: Fred Barlow, Ph.D., University of Arkansas
- Broadband: Jens Mueller, Ph.D., University of Erlangen
- Fiber Optic and Electrooptic: Alan Lyons, Ph.D., Lucent Corp.
- LTCC: Mike Lanagan, Ph.D., Penn State University
- Materials: Dan Amey, DuPont Electronic Technologies
- Automotive: D H Sarma, Ph.D., Delphi Automotive
- Integrated Passives: William Borland, DuPont Electronic Technologies
- Testing and Measurement: Mike Janizec, NIST
- Assembly: Paul Collander, NOKIA
- Base Stations: George Passiopoulos, NOKIA
- Military: John Roman, Consultant
- Novel Applications: Steve Dai, Motorola
- Ceramic Interconnect Markets: Rick Sigliano, Kyocera Americas
In addition, keynote speakers are expected to review technology and applications in areas of high interest, including embedded passives, automotive, microfluidics and MEMS. The growth of wireless communication to its current pervasive position in both developed and developing nations, extending from microwave to millimeter wave, continues to create a host of opportunities for which ceramic technology is enabling. At the same time, the demand for bandwidth driven by the Internet and data communications has sparked increased need for optical communication equipment. For many new interconnect and packaging applications for performance at 40 Gb/sec and beyond, ceramic is again uniquely suited.
Taipei, Taiwan and Boston -- SigmaTel has selected Teradyne's Integra J750 test system.