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Leo J. Smith Joins Tessera Technologies
December 31, 1969 |Estimated reading time: Less than a minute
Smith is responsible for the worldwide business development ofTessera's µZ(tm) Multi-Chip technology family, including the µZ-Ball Stacked and µZ-Folded packages. Prior to Tessera, Smith held various management positions at Amkor Technology, including director of new product development, where he was responsible for the development and deployment of Amkor's 3-D packaging products. Smith has more than 22 years' experience in electronic packaging, including 17 years in the flexible printed circuit industry at Rogers, ADFlex Solutions and Sheldahl.
By Christine F. Della Monaca