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Amkor Extends Business Alliance With Agilent Technologies
September 5, 2002 |Estimated reading time: Less than a minute
Under this agreement, Amkor will become Agilent's virtual backend operations and supply chain resource, supplying services that include semiconductor package design, wafer bump process qualification, and wafer bump and IC package assembly for high-performance application specific integrated circuits (ASICs).
Herndon, Va. -- The National Electronics Manufacturing Initiative (NEMI) is sponsoring a workshop to address the business implications of product take-back and recycling, October 10 through 11 in Colorado.