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Cookson Electronics Showcases Multiple Products at SEMICON West
December 31, 1969 |Estimated reading time: 12 minutes
Compiled By SMT Staff
SAN JOSE, Calif. - At SEMICON West in July, the newly formed Cookson Electronics - Semiconductor Products business unit introduced several new products that address several manufacturing challenges faced by semiconductor package manufacturers and assemblers.
Cookson Electronics set up a simulated manufacturing line with 8" wafer capabilities integrating the MPM SPM wafer printer, Cookson Electronics' CAMALOT dual-lane XyflexPro dispensing system and the ACCEL MicroCel centrifugal cleaning system. The three products clarify three flip chip underfill methods.
At the show, Cookson Electronics also introduced the MicroDot dispensing pump, which allows the CAMALOT XyflexPro dispensing system to support microdot dispense applications down to 0.006", in addition to encapsulation and underfill dispensing for semiconductor packaging.
Other new product announcements included STAYCHIP 3080 moisture-resistant capillary flow underfill for semiconductor packaging and harsh environment applications, a newly refined version of the CAMALOT MPP-QC multi-piston pump, and STAYCHIP NUF-2076E no-flow underfill.
AIM Signs Licensing Agreements
CRANSTON, R.I. and TAIWAN - AIM Inc. signed a worldwide license agreement for AIM's patented lead-free alloy, CASTIN, with Accurus Scientific Co. Ltd. and Dyfenco Electronic Chemical Corp.
The agreement enables Accurus and Dyfenco to manufacture and sell the CASTIN alloy throughout the world in all solder forms, including solder paste, solder bar, wire solder and preforms.
CASTIN is an environmentally safe, lead-free solder comprised of tin, silver, copper, and a grain-refining and temperature-reducing dopant. It is said to feature a relatively low melting temperature, offer superior joint strength and inhibit intermetallic growth during high thermal temperature cycling.
Carl Seelig, AIM's vice president of Technology, and Douglas Hsu, Dyfenco's general manager.
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FeinFocus Forms Feinfocus AG
STAMFORD, Conn. and GERMANY - FeinFocus USA and feinfocus GmbH have formed a new corporate parent, Feinfocus AG.
This move aims to unify both companies as partners to execute a single, global corporate strategy. It was precipitated by FeinFocus' growing presence in global markets, particularly the increasingly critical regions of North America and the Far East. The company bases its business strategy on frequent communication with its customers, and believes they are best served by a partner with global presence and a single strategy. The development of Feinfocus AG is a logical next step in the company's commitment to serving customers worldwide with one standard of quality and technical expertise.
Photon Dynamics Acquires ISIS
SAN JOSE, Calif. and MONTREAL - Photon Dynamics Inc. completed its acquisition of the Infrared Screening and Inspection Solutions (ISIS) Div. of ART Advanced Research Technologies Inc. in July.
ART is a developer of optical and infrared imaging technologies for the detection of anomalies in the medical sector and the electronics industry. Photon Dynamics believes the acquisition will extend its product portfolio and intellectual property with the additional product offerings for broad fault coverage of printed wiring assemblies (PWA), thereby expanding its yield management capabilities for OEMs and electronics manufacturing services (EMS) companies in the electronic industry.
ATExpo Features Conferences, Products
NORWALK, Conn. - The Assembly Tech-nology Expo (ATExpo) 2002 Conference will feature state-of-the-art education for manufacturing professionals by several of their most respected industry associations.
The conference is held concurrently with ATExpo, the world's largest "all assembly" trade event, which will take place September 24 through 26, 2002, at the Donald E. Stephens Convention Center in the Chicago suburb of Rosemont, Ill. The ATExpo Conference commences one day earlier on September 23.
Industry organizations presenting conference sessions at the ATExpo 2002 Conference include APICS, the Educational Society for Resource Management; the Adhesives and Sealant Council (ASC); the Edison Welding Institute (EWI); the Society of Manufacturing Engineers (SME); and the Wiring Harness Manufacturers Association (WHMA).
Conferees can create a customized curriculum from a wide variety of workshops and technical sessions covering five tracks: Manufacturing Management, Automated Assembly, Lean Manufacturing, Materials Joining and Wire Processing. Sessions will focus on a variety of high-interest topics, including work cell design, robotic controls, lean automation, supply chain collaboration, laser welding, adhesive bonding and many more.
At ATExpo, more than 700 leading suppliers will demonstrate and display new products in more than 50 categories. These products find application in manufacturing industries including automotive, electronics, industrial equipment, medical and aeronautical/aerospace.
SMTA International Events Focus on 0201 Assembly
MINNEAPOLIS - For industry professionals involved in 0201 assembly, three technical sessions and one lecture during SMTA International (September 22 through 26, 2002, at Donald Stephens Convention Center in Rosemont, Ill.) will be dedicated to issues regarding design, assembly, inspection and cost of using 0201 components.
On Tuesday, September 24, from 1:30 to 3 p.m., the technical session, SMT2: 0201 Assembly will center on 0201 assembly solutions that a diverse group of manufacturers have developed. Also on Tuesday, from 3:30 to 4:30 p.m., "A Statistical Approach to 0201 Component Usage" will be presented free to all attendees. This presentation shares a model to assist in determining the true cost of designing 0201 packages into circuit board assemblies.
On Wednesday, September 25, from 8:30 to 10 a.m., the technical session, MFX1: Design for 0201 will provide information on successfully designing and implementing 0201 component assembly into normal manufacturing operations. Also on Wednesday, from 10:30 a.m. to 12 p.m., the technical session, PRC2: Automated Optical Inspection (AOI) will examine the capabilities and applications of automated inspection of 0201 assemblies. The advantages and methodologies of automated inspection will be presented and discussed.
Loctite Renamed Henkel Loctite
ROCKY HILL, Conn. - The Loctite Corp. in the United States changed its legal name officially to Henkel Loctite Corp., and in the near future, Loctite companies worldwide will follow suit.
The Henkel Group, headquartered in Düsseldorf, Germany, acquired Loctite in 1997. Loctite as a brand name will remain the same, as it is the brand under which the Henkel Group markets a broad range of engineering adhesives in the electronics, automotive, aerospace, biomedical and general industrial markets.
DEK Extends Stencil and Custom Tooling Capabilities
ZURICH, Switzerland - DEK strategically expanded its stencil and custom-tooling capabilities by acquiring Acumen Technology.
The new business will be known as Acumen Technology, a business of DEK. Leaders of both DEK and Acumen Technology have said that customers will benefit from the extended infrastructure and in-depth support the new business will bring to the market.
Electronics Workbench, WISE to Provide PCB Design Environment
TORONTO and NEWBERG, Ore. - Electronics Workbench and WISE Software Solutions entered into an OEM agreement that provides mainstream PCB developers a total design environment from schematic capture and simulation, to layout, autorouting and manufacture.
Under the agreement, Electronics Workbench will integrate the WISE GerbTool CAM software with its Ultiboard 2001 PCB layout tool (PowerPro Edition).
ASSET Introduces New Program
RICHARDSON, Texas - ASSET InterTech Inc. introduced a new third-party program for Ensure DFT (EDFT), Asset's design-for-test services division.
The EDFT Partner Program will team EDFT's expertise in test strategies and implementation techniques with third parties that have experience in migrating boundary-scan tests from an electronics company's design group to a volume manufacturing environment.
The first member of the EDFT Partner Provider program is BreconRidge Manufac-turing Solutions Corp.'s test engineering group, which formerly operated as 4Test Inc. BreconRidge will offer boundary-scan test services in Canada based on ASSET's ScanWorks environment.
Book-to-Bill Reaches a Plateau
NORTHBROOK, Ill. - The IPC PCB book-to-bill ratio for June was 0.96, meaning $96 worth of orders for new boards were received for every $100 billed (shipped). The ratio remained the same as the May level. Sales billed (shipments) in June 2002 decreased 19.1 percent from June 2001, and orders booked decreased 13.8 percent from June 2001. Compared to 2001, PCB bookings are down 23.3 percent YTD, while PCB shipments are down 33.4 percent YTD.
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Q & A: characterizing UltraCSP Assembly
Q:What is the best way to characterize UltraCSP component assembly?
A:A customer approached us to analyze their initial chip scale package (CSP) assembly and provide recommendations for optimizing solder joint integrity. The methodical approach taken was similar to that performed for UltraCSP components, BGA, and flip chip and wafer-level CSP devices. The analysis included X-ray, cross-sectioning, optical and scanning electron microscopy (SEM), energy dispersion spectrometry (EDS) and elemental mapping.
X-ray Analysis. Multidirectional X-ray determined initial solder joint quality and identified areas for cross-sectional analysis. One solder ball appeared smaller than the others. From a side angle, the ball appeared to be attached to the board pad. Based on the number of voids in all solder joints and the typical wick appearance around each trace, adequate reflow was achieved. X-ray identified a line of solder balls for cross sectioning. A second sample revealed no problematic areas and cross sectioning was performed. A third sampling detected two adjacent solder balls as being smaller than others. The location of these solder balls was on the opposite side of the package compared to the small solder ball in the first sample. Side-angle X-ray indicated a solder joint board connection. This sample was cross-sectioned through the row of solder balls containing the smaller joints.
All three samples appeared to have achieved solder reflow; no large voids were detected. Two of the samples exhibited problematic solder balls. However, the joints did make sufficient contact.
Cross Sectioning. After X-ray, the three samples were cut from their boards and potted in a quick-curing epoxy to allow proper polishing without damagingjoint integrity. Cross sectioning was performed through the rows of balls containing the small solder joints. Stereoscope inspection of samples 1 and 3 confirmed small solder balls. All exhibited sufficient wetting to the board pads; however, wetting predominately was down one side of every pad. Solder mask misregistration to board pads prevented symmetrical wetting, leading to weaker joints and a reliability decrease. Additionally, the smaller solder joints (20 percent smaller and accentuated by the solder mask misregistration) would be weaker than the others and potentially result in earlier failures. In sample 3, solder mask misregistration was extensive, resulting in solder wetting along one pad side but terminating on top of the opposite side's pad. A high-stress area formed, typically leading to crack generation and early failure. Cross-sectioning results from sample 2 exhibited the same solder wetting appearance as samples 1 and 3. As suspected from X-ray analysis, no solder joint size or shape differences within this sample were observed.
SEM. SEM analysis obtained high-resolution images of sample 3. Minor, nondefective solder voiding was detected. EDS analysis determined joint quality based on the intermetallics formed. Elemental mapping determined the elements present and their positional concentration. A copper/tin intermetallic region just above the nickel layer on the board was found. Copper presence at this location could be from pinholes in the nickel barrier layer. Large intermetallic regions in this area of the solder joint can result in a more brittle interconnect and early failures. The nickel and gold layers were dispersed randomly throughout the joint.
The results indicated that improvements were needed in board quality and stencil printing. With more advanced components such as UltraCSPs, the effects of all variables become more pronounced.
Craig Beddingfield is senior technical market manager and Paul Houston is advanced process development engineer at Advanced Assembly Technology for SiemensDematic Electronic Assembly Systems Inc., Norcross, GA.
IPC Programs Offer PCB Designers Taste of Certification Program
NORTHBROOK, Ill. - The IPC Designers Council has created two interactive training aids for printed circuit board (PCB) designers who want to test their basic knowledge about design.
The programs, one for potential Certified Interconnect Designers (CID) and the other for Advanced Certified Interconnect Designers (CID+), consist of eight to 10 sample questions and mimic the two-hour final exam a designer must pass to become certified in the IPC Design Certification program. An English version of the interactive programs can be accessed and downloaded at http://dc.ipc.org/education/workexams.htm, with a German translation in the works.
More than 1,600 designers globally have been certified through the IPC Design Certification program, which assesses a designer's knowledge of how to transform a schematic into a reliable rigid PCB design that can be manufactured, assembled and tested. The certification test is based on several critical IPC documents that link design principles to the end product use of the PWA.
NEPCON East Celebrates Success
NORWALK, Conn. - The 40th annual NEPCON East electronics manufacturing trade show and conference, held June 10 through 12, 2002, at the Bayside Expo and Conference Center in Boston, drew 2,754 attendees interested in the latest products and technologies available to help reduce cycle times, minimize defects and cut costs.
The NEPCON East and co-located Electro exhibit hall showcased a comprehensive array of electronics assembly products and services, including adhesives, components, contract services, hand tools, production equipment, soldering, test and inspection, workstations, and more.
Assembly East will co-locate with NEPCON East/Electro from June 10 through 11, 2003, at the Bayside Expo and Conference Center in Boston.
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People
Cobar Europe, Breda, The Netherlands, promoted Ineke Van Tiggelen-Aarden to technical manager. She will be responsible for overseeing the company's line of soldering products, quality and R&D laboratory facilities, and ISO 14000 quality compliances.
van Tiggelen-Aarden
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Ion Systems Inc., Berkley, Calif., supplier of electrostatics management products and services, added Thomas M. Rohrs, senior vice president of applied materials, to its board of directors, increasing its size to seven members.
Dominic Yeo was appointed director of global facilities engineering, Polyclad Laminates by Cookson Electronics PWB Materials & Chemistry, Londonderry, N.H. In this new position, Yeo will be responsible for major capital project planning and implementation for Polyclad Laminates operations worldwide.
Yeo
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Lisa Carbin joins DEK, Flemington, N.J., as sales manager, Western region. Carbin will work with the company's customer service team to provide a focused and coordinated approach to supporting clients.
Carbin
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Companies
Process Sciences Inc., Austin, Texas, launched its new upgraded Web site located at www.process-sciences.com, providing answers and access to a wide range of services provided by the company. The Web site also features an "Ask Mr. Process," a survey questionnaire, industry news, technical training program outlines and analytical testing information.The U.S. headquarters and operations of Panasonic Factory Automation Co., Franklin Park, Ill., relocated to Elgin, Ill. The new facility houses the company's full range of departments including sales, customer service, parts, training, demonstration and support operations.
Cogiscan, Quebec, Canada, aligned with Production Automation Corp. to provide sales representation for the Cogiscan line of automated material and process control systems. Under this agreement, Production Automation will represent Cogiscan in Minnesota, North Dakota, South Dakota, Iowa and Northwestern Wisconsin.
Viscom AG, Hanover, Germany, expanded its world headquarters facilities in Hanover, Germany to include a new main building and a third production facility.
Clarification
Due to an inadvertent error, the cover photo in July SMT should have had the component feeders oriented in a horizontal fashion. We regret July's cover orientation and include the photo as it should have run.