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Ask and Answer - August 14, 2002
August 15, 2002 |Estimated reading time: Less than a minute
QUESTIONSEmmett Redd of Half Way, Mo., writes: I am soon to release my first surface mount printed circuit board design to a manufacturing house. A component in the design has been discontinued and a possible substitute will fit on the currently designed pads, but each pad is three to four times as large as specified for the new part; the new part's pins will rest on ends of the pads nearest to the part's center. The pads are 4.1 x 1.5 mm and the recommended pads are 1.2 x 1.5 mm. Will there be a problem with the excess solder paste on the pads that the part's pins don't need? Thank you. Reference Number: 081501
San Mateo, Calif. -- ElectroniCast President Stephen Montgomery will be the keynote speaker at the Current State of the Photonics Industry Lecture Series at the International Photonics Technology Conference (IPTC), September 5 through 7, 2002, at the COEX Convention Center in Seoul, Korea.