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IPC and NEMI Sponsor Symposium on Lead-Free Electronics September 18-19 in Montreal
July 24, 2002 |Estimated reading time: Less than a minute
IPC is offering half-day and full-day education courses on Wednesday the 18th, followed by a final report from the NEMI Lead-Free Assembly Project on the 19th. The NEMI session will also be webcast for anyone interested in attending but unable to participate onsite.The IPC education programs offer one full-day session on lead-free assembly and soldering, and three half-day sessions on lead-free solder joint reliability; lead-free soldering, focusing on metallurgical fundamentals, reflow applications and challenges; and final finishes, looking at HASL (hot air solder leveling) and its lead-free alternatives.
Nashua, N.H. and Lisle, Ill. -- Teradyne Inc. Connection Systems Division (TCS) and Molex Inc. have launched a Web site they co-developed to give customers access to in-depth information about the VHDM-HSD family of connectors.