-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SOLDERTEC Launches EU Industry Survey About November 2002 Lead-Free Technology Roadmap
July 22, 2002 |Estimated reading time: Less than a minute
This work will ensure that European opinions are properly represented in the preparation of a Global Lead-Free Roadmap later this year. Any company is invited to participate and the deadline for completion is the beginning of September 2002.The main aims of the lead-free roadmap are:
- Supply chain synchronization (consolidating target dates on an international scale for components, materials suppliers and equipment assemblers);
- To provide guidelines on preferred solder alloys, plating types and associated material compositions;
- To coordinate information on preferred process production profiles and potentially provide guidelines on component temperature qualification requirements and on standard process profiles; and
- To highlight any technical and commercial issues which need to be addressed, such as upgrading of equipment, recycling processes and labeling.
A recent Japanese survey associated with this roadmap development work has illustrated a conflict between the plans and expectations of parts manufacturers, and those of final assembly companies. This is an example of an issue that can be resolved through industry roadmapping.
Taiwan and San Jose, Calif. -- Walton Advanced Electronics has signed a Tessera Compliant Chip license that will enable Walton to build advanced packages for high-performing DRAM chips used in gaming consoles, corporate servers and other performance-intensive computing products.