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Gel-Pak Opens New East Coast Quik-Pak Facility
July 12, 2002 |Estimated reading time: Less than a minute
The new facility will provide quick turn assembly and prototype services for any IC (integrated circuit) plastic package, featuring Quik-Pak's patented open-cavity process. Assembled units can be left open for FIB work or die probing if needed.
Lexington, Mass. -- Raytheon's Reliability AnalysisLaboratory ( www.ReliabilityAnalysisLab.com) has expanded its electronic component analysis services to include more detailed investigations in the areas of materials characterization, non-destructive evaluation and test (NDE/NDT), and surface analysis of microprocessors, discrete components, and printed circuit boards and assemblies.