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Component Specifier
December 31, 1969 |Estimated reading time: 10 minutes
As SMT matures and its end products continue to shrink in size but grow in capability, manufacturers are constantly in need of components that satisfy demanding footprint, reliability and placement requirements. Modern manufacturing techniques are useless if a board's components are out of date, perform poorly or fail to satisfy end-user requirements. To assist manufacturers in this search, SMT Magazine presents Component Specifier, a product section designed to spotlight state-of-the-art active, passive, odd-form and interconnect components.
ActiveDevices capable by themselves of controlling voltages and currents to produce gain or switching actions in analog or digital circuits, i.e., reacting to an applied signal, they can change their basic character.
PassiveDevices that do not change their character when electrical impulses are applied, i.e., they provide a single, repeatable reaction.
InterconnectDevices that provide mechanical and electrical union/ disconnection and consist of mating plugs and receptacles (sockets) to join PCBs with cables, racks, chassis or other PCBs (stacking); actual connection to the board, however, must be via surface mount-type contacts.
Odd-FormDevices whose geometrical form factors are singular but not necessarily unique such that they must be mounted manually. Their housings (as opposed to their basic functions) are nonstandard as to shape. Examples include many transformers, hybrid circuit structures, fans/blowers, mechanical switching blocks, etc.
ACTIVE
Integrated Power SolutionThe CMPWR160 IC, which provides an integrated power management solution targeting Universal Serial Bus Peripherals and other hot insertion equipment, is available. The product combines a low dropout regulator with a power-on-reset pulse generator. Other features include a low quiescent current of 35 μA while reportedly delivering up to 500 mA of load current at a fixed 3.3 V output, a shutdown mode current of 7 μA and a thermally enhanced 8-pin SOIC package. California Micro Devices Corp., Milpitas, Calif.
MOSFET RoadmapThe PowerPAK is a roadmap for advanced power MOSFET packaging technology that is expected to provide significant space savings and improved thermal performance for power conversion and power management circuitry in computers, communications networks and hand-held information appliances. The new technology is said to enable devices with thermal resistance of less than 1°C/W, or approximately the same as a twice-as-large, twice-as-thick DPAK power MOSFET. These devices achieve this performance by providing a direct thermal path from the backside of the copper die attach pad to the PCB. The design provides a consistent footprint regardless of the particular silicon used in a given device, thus eliminating the need for retooling to accommodate devices with different on-resistance ratings. Siliconix Inc., a subsidiary of Vishay Intertechnology Inc., Malvern, Pa.
MicroprocessorMPC7450PowerPC, a member of the fourth-generation PowerPC family, reportedly delivers low-power, best-of-class solutions for the networking, telecommunications, high-end embedded systems, scientific computing and desktop computer markets. The microprocessor, which is said to have an advanced, deeper, seven-stage pipeline with two additional execution units and an enhanced AltiVec engine, is shipping at 533, 667 and 733 MHz. The L2 cache has been integrated onto the die for greater speed, and a 256-bit datapath to the L1 cache has been implemented. Motorola SPS, Austin, Texas.
PASSIVE
Board-level IndicatorsA new line of PCB-level indicators, now offered in more styles, colors and options than previously offered by any supplier, is available. The indicators reportedly use the latest LED chip technologies and operate with current levels as low as 1 to 5 mA. Designers may choose from having round 2, 3 or 5 mm lenses, in addition to various square and rectangle versions with a wide range of packaging options and different lead styles. Color choices include red, orange, green, yellow and blue, plus many combinations of these colors in a single unit. Lumex Inc., Palatine, Ill.
Dual Transmitters and ReceiversA new family of small form factor dual transmitters and dual receivers has been developed for high-performance optical communications. These unidirectional devices are expected to meet the growing need for high-density multi-channel optical links in today's increasingly complex routers, switches and telecom applications. Housed in an industry-standard SFF transceiver package with two LC fiber optic interfaces, each unit contains either two transmitters or receivers. They are available in 850 and 1,310 nm versions, for any data rate up to 2.7 Gbps. Stratos Lightwave LLC, a subsidiary of Stratos Lightwave Inc., Chicago, Ill.
Aerogel CapacitorsPowerStor ultra-low ESR aerogel capacitors feature three new models. The B series is cylindrical and has a high-specific capacitance, or high-capacitance by volume, when compared to other brands. The M series is a leaded component designed for memory backup and hold-up power applications. It features standard lead spacing to fit into existing PCBs using memory backup supercapacitors. The S series is a surface mount version of the M series, and also is designed for memory backup and hold-up power. The series reportedly allows manufacturers to assemble PCBs in a single pass and save time by not hand stuffing and hand soldering a leaded supercapacitor in place after component installation. All three series are available in a variety of the most popular capacitances and dimensions. Cooper Electronic Technologies, Boynton Beach, Fla.
Isolation and Signal TransformerModel PT75571 isolation and signal-conditioning transformer, developed specifically for Conexant's SmartDAA Modem Chip, is said to be a cost-effective, reliable interface. Combining performance and durability, the transformer has a primary inductance of 40 μH at 4 MHz. Key electrical parameters include Cww (line to chip) of 10 pF maximum at 1 Mhz and dielectric withstanding voltage of 2,500 Vrms (UL1950/EN60950 for reinforced insulation). Datatronics Romoland Inc., Romoland, Calif.
Chip ResistorsThe PWCR series of thick film pulse withstanding chip resistors reportedly achieves significant power ratings in a limited space, offering an alternative to the large axial leaded resistors without compromising power ratings and pulse withstanding capabilities. The resistors are available in four standard sizes (0805, 1206, 2010 and 2512) with power ratings from 0.125 to 1.5 W at 70°C. Their enhanced performance is achieved by using special thick film inks and a specifically developed production process. International Resistive Co. Inc., Corpus Christi, Texas.
Miniature Precision Resistors1H (0201) and 1E (0402) are lightweight, miniature resistors that offer high reliability and stability. The precision tolerances and small sizes reportedly make them ideal for the demands of smaller, high-performance telecommunications applications. Resistance ranges for these new sizes are 82 to 12 KΩ for 1H (±2 percent) and 10 Ω to 1 MΩ for 1E (±1 percent). The metal glaze thick film design of the series is said to ensure heat and moisture resistance. KOA Speer Electronics Inc., Bradford, Pa.
Low-inductance Chip Capacitors0306 low-inductance chip capacitors are for use in high-speed circuits for microprocessor decoupling applications in computers and servers. Available in X7R and Y5V dielectrics, with voltage ratings from 10 to 25 V, these capacitors also are said to be suited for use in high-temperature applications. These chips have a low profile, reportedly making them ideal for surface mounting on densely populated PCBs or for "inside cavity" mounting adjacent to the IC itself. Reverse geometry termination and the small case size have reduced the inductance of these capacitors by half, compared to conventionally terminated chips of similar capacitance and voltage ratings. AVX Corp., Myrtle Beach, S.C.
Small VCO ModulesFour new voltage-controlled oscillators were developed for the high-growth, dual-band, trimode CDMA/PCS cellular handset industry. Models ATXN1032A and KXN1458A are small, low-cost, dual-band oscillators reportedly designed for low-current drain to extend battery life and phase noise performance for improved call handling. Model ATXN1013A is a small, dual-band VCO/PLL module designed to minimize phase noise and reduce lock times to less than 1 mS for improved data transmission integrity. Model ATXN1014A is a small, dual-band synthesizer module that provides performance advantages by including temperature-compensated crystal oscillator technology to reduce cellular handset size, component count and total cost. CTS Corp., Elkhart, Ind.
INTERCONNECT
Specialty ConductorsA new series of high-density 0.050" edge card connectors, introduced to augment the traditional 0.050" spacing product line, is available with right-angle bends and with or without mounting ears. This is expected to allow for higher-density applications vs. the traditional 0.100 and 0.156" products. These parts are available in all common architectures (PCI, MCA, etc.), as well as in a wide variety of sizes, from 6 (2 x 6 contcts) to 110 positions (2 x 110 contacts). The connectors also are available in various insulator materials, including reflow-compatible parts, molded in PCT. Sullins Electronics Corp., San Marcos, Calif.
Cable Interface ExpansionThis company expanded its cable interface line to include high-speed coaxial cable interfaces and flex cable interfaces along with its line of micro and standard pitch insulation displacement cable assemblies. High-speed cable assemblies (EQCD Series) using 38 AWG miniature coax ribbon cable reportedly are designed for 50 and 75 Ω systems. These assemblies may be terminated with a variety of male and female high-speed connectors in various orientations to meet specific customer needs. Samtec Inc., New Albany, Ind.
Field Bus ConnectorThe Profibus-dp, a newly developed interface connector for the field bus system, is said to be an economical, reliable and easily customized interconnect solution. One connector type for both termination and node versions is offered; an integrated switch makes connector type selection possible, even after installation. The compact design features horizontal cable entry and strain relief. Additionally, the connector housing is metalized to guard against EMC disturbances, and safe data transmission reportedly is guaranteed by the integrated inductivities. Also available is the node version with D-sub connector, reportedly allowing programming without data transmission interruption for hot swapping. 2E SysCom Inc., Waltham, Mass.
Bottom-entry ReceptaclesBottom-entry receptacles supplied on tape for surface mount applications now are available. Among the features are the use of #02 contact, designed to accept a pin or component lead 0.040 to 0.050" and 12 mm-wide carrier tape to feed industry standard pick-and-place machines. The product also mounts in a 0.090 ±0.003" PTH and is said to be designed for an "intrusive reflow" assembly and soldering. Mill-Max Manufacturing Corp., Oyster Bay, N.Y.
Visual Interface ConnectorThe Digital Visual Interface (DVI) connector conforms to the Digital Display Working Group DVI Standard and is available as a right-angle socket in both digital and digital/analog to better meet the demand for clearer and better computer images. The body reportedly is made of thermoplastic with glass-fiber reinforcement and the contact material is copper alloy with 30 μ" gold plating on contacts. The DVI connector is reflow compatible and is available in black or white. Kycon Inc., San Jose, Calif.
Increasing PCB Throughput Reliably
By Kevin Steele
The continual pressure to reliably increase throughput despite increasingly complex PCBs leaves SMT manufacturers constantly driving for better, faster, less expensive ways to build their machines. The motion control subsystem always has played an important role in the performance of chip mounters and SMT assembly equipment. Motion control choices in SMT machine design also have affected system cost and reliability.
Centralized motion control solutions generally are bus-based, with multi-axis motion controllers providing analog command voltages or PWM commands to servo amplifiers that may be a significant distance away. Some amplifiers still require potentiometers to be adjusted for the digital drives' position, velocity and current control. A plethora of application-specific mixing and matching of these units achieves various levels of satisfactory motion control results.
Distributed motion control solutions eliminate the motion controller and rely on placing the position controller next to the servo amplifier (in some cases combining the two), thus placing the intelligence for control out at the motors. Significant cabling is eliminated and noise reduced.
Traditional servo systems often consist of high-performance host computers that communicate to high-performance DSP-based, multi-axis motion controller cards, interfacing with a number of drives or amplifiers, which often have their own high-end processors on board. This can be expensive. In a number of these cases, the level of communication between the high-end computer and the motion controller can be broken down into three categories: simple point-to-point moves with non-critical trajectories; moves requiring coordination and blending, with trajectory generation being tied to the motion of the machine; and complex moves with the trajectories that are critical to the process or machine. The three basic levels of motion complexity require different features and functions from the distributed servo controller/amplifier.
Integrated, Digital Motion ControlFor SMT equipment, motion controllers and servo amplifiers can be mounted directly in the gantry on the SMT heads. This provides what is referred to as a distributed system, resulting in a solution with significantly reduced wiring harness and the associated electrical noise, thereby reducing cost and improving reliability. By increasing the number of power stages on the head, the unit can drive more than one motor independently, limited only by the processing power of the controller's DSP.
To implement a distributed servo controller/amplifier, the module must meet two basic system requirements: processing power to control all aspects of a multi-axis move; and fast and deterministic communication between the host computer and the servo controller/amplifier realized in an integrated module with small size and low mass.
For more information, contact KEVIN STEELE, general manager for robotics and automation at Agile Systems Inc., (805) 966-0909; E-mail: ksteele@agile-systems.com.