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Die Products Workshop Brings Technical Information on Latest Microelectronics Trends
October 19, 2001 |Estimated reading time: Less than a minute
Austin, Texas -- Technical topics and market updates about the latest system-in-a-package (SIP) enabling technologies, as well as networking opportunities, captured the attention of 90 attendees at the Eighth Annual Known Good Die (KGD) Packaging and Test Workshop in Napa, Calif., September 10-12.