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Tessera, Intel to Develop Stacked CSPs
July 3, 2001 |Estimated reading time: Less than a minute
The dual effort includes a multi-die, CSP that uses Tessera's stacked packaging technology to vertically mount three die in a single package less than 1 mm high. By integrating multiple silicon die into a single CSP, stacked packages offer savings in cost, weight and board space.
FLEMINGTON, N.J. - DEK Printing Machines has been a principal partner in Universal Instrument's annual technology consortium for the past six years. Managed and run out of the SMT Laboratory at Universal's headquarters in Binghamton, N.Y., the 2001 Area Array Consortium focuses on developing fully documented processes that can be implemented in live production facilities to produce high-quality product at high yields.