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According to SMTA Internet Committee Chair Gary Tanel, Micro-ASI, "Our goal initially was to create a function online that was a no-brainer, hands-down benefit for anyone who was considering membership with the SMTA. What better than to put volumes of the highest quality information regarding advanced electronics assembly directly online?"
RESEARCH TRIANGLE PARK, N.C. - Unitive Advanced Semiconductor Packaging opened a new bumping facility in Hsin Chu Industrial Park, Hsin-Chu, Taiwan. Having just completed production qualification and currently ramping volume production for initial customers, Unitive Semiconductor Taiwan Corp. (UST) will operate the new state-of-the-art wafer-level packaging and solder bumping facility. UST is a joint venture company established between Unitive and a set of Taiwanese partners.