-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA Knowledge Base Features Online Resource
June 22, 2001 |Estimated reading time: Less than a minute
According to SMTA Internet Committee Chair Gary Tanel, Micro-ASI, "Our goal initially was to create a function online that was a no-brainer, hands-down benefit for anyone who was considering membership with the SMTA. What better than to put volumes of the highest quality information regarding advanced electronics assembly directly online?"
RESEARCH TRIANGLE PARK, N.C. - Unitive Advanced Semiconductor Packaging opened a new bumping facility in Hsin Chu Industrial Park, Hsin-Chu, Taiwan. Having just completed production qualification and currently ramping volume production for initial customers, Unitive Semiconductor Taiwan Corp. (UST) will operate the new state-of-the-art wafer-level packaging and solder bumping facility. UST is a joint venture company established between Unitive and a set of Taiwanese partners.