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VIA Unveils 0.13 Micron Processor
December 31, 1969 |Estimated reading time: Less than a minute
"TSMC has invested significant resources in bringing our high-performance 0.13 micron process to market," said Dr. FC Tseng, president of TSMC. "That such a strategic customer as VIA will leverage the benefits of our world-leading technology for its next generation of processors, speaks volumes for this accomplishment. We are committed to providing them with the highest quality manufacturing support available."