-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
EMI/RFI Industry Leaders Merge
December 31, 1969 |Estimated reading time: Less than a minute
With more than 1,500 employees worldwide, as well as sales, manufacturing and support facilities in North America, Asia and Europe, Laird Technologies will be the world's leading manufacturer of high-performance EMI/RFI shielding. Martin L. Rapp, former president of APM, has been named CEO, and James A. Sezwick, formerly executive vice president of instrument specialties, will serve as president of the new organization.
ADHESIVES, COATINGS AND ENCAPSULANTS3567 Reworkable UnderfillThe first commercially available reworkable underfill, Loctite 3567 provides the reliability and ease of processing of conventional thermoset underfills. It allows flip-chips to be replaced on any device after testing determines that a chip is defective, minimizing board disposal and improving the cost-effectiveness of the manufacturing process. The underfill improves the reliability of BGA and CSP assemblies, particularly important for roughly handled consumer electronic applications. Simply heating the defective device to standard rework temperatures allows it to be removed from the PCB. Gentle high speed brushing eliminates any remaining residue and prepares the site for a replacement device. Loctite