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Park Announces Major Expansion of its Nelco Singapore Facility
December 31, 1969 |Estimated reading time: Less than a minute
The company's Nelco Singapore facility currently has manufacturing capacity of approximately US$120 million per year. When completed, the expansion program is expected to increase the annual manufacturing capacity of the facility to approximately US$200 million. This expansion will incorporate the new manufacturing technology the company has recently developed with its equipment suppliers in the area of next-generation treating, automated set-up, automated lay-up, vacuum pressing and automated finishing. These new manufacturing technologies are designed to improve cycle times, product quality, product technology, manufacturing yields and efficiencies and productivity and to reduce manufacturing costs.
ADHESIVES, COATINGS AND ENCAPSULANTSMicrocure 5100The Lambda Technologies MicroCure 5100 curing system features patented Variable Frequency Microwave (VFM) technology. This eliminates the hot spots and arcing associated with conventional microwave technology, allowing significantly faster curing of standard, qualified encapsulants and adhesives. By reducing cure times to five minutes or less, VFM meets the critical industry challenge of providing increased throughput for advanced packaging technologies. Applications include cavity dam & fill, glob-top, underfill and bonding, for die-attach, BGA, multi-chip module, chip-on-board/direct chip-attach and chip-scale packaging. Lambda Technologies Inc.