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1994 SMT VISION AWARDS WINNERS
December 31, 1969 |Estimated reading time: Less than a minute
ADHESIVES, COATINGS AND ENCAPSULANTSEncapsulantsThe "9000" series encapsulants made of a urethane resin cures with UV light in 15 to 90 sec. The encapsulants come in a full range of thixotropic viscosities, and because the encapsulants are aerobic and solvent-free they require no refrigeration during storage. Under these conditions, the shelf life is one year. The encapsulants may be used for chip-on-board, MCMs and smart cards. The encapsulants provide protection for the bare chip and are suitable for chip on board, MCMs and smart cards. They also have thermal and mechanical absorption capabilities. Matching coefficients of thermal expansion between encapsulant and substrate is not necessary. Dymax Corp.