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1993 SMT VISION AWARDS WINNERS
December 31, 1969 |Estimated reading time: Less than a minute
ADHESIVES, COATINGS AND ENCAPSULANTSEnvironmentally-Benign Solder Replacement"Poly-Solder" conductive adhesive provides highly stable electrical junctions with performance akin to solder joints. A patented contracting polymer binder system, filled with special penetrating conductive particles, is the key to stable electrical connections that endure temperature and humidity as well as thermal cycling. Engineered polymer compression during cure forces metal particles through the common oxides found on SMDs and circuit boards. The joints can show a decrease in junction resistance after 1000 hours of 85%RH/85ºC, instead of the catastrophic failure seen with typical silver epoxies. These pseudo-metallurgical junctions are the enabler for successful solderless assembly with an environmentally-benign joining material. The adhesive offers additional benefits: low hazards for people and the environment; absolutely no cleaning; compatibility with virtually all substrates, even non-solderable surfaces; low temperature processing (130ºC), low thermal stress and no substrate damage; wide processing window, factory-friendly, easy control; exceptional temperature cycle performance even for TCE-mismatched systems; no residuals, excellent SIR values; ultra-fine-pitch capability; runs on standard SMT reflow lines, no new equipment needed; reworkable. Alpha Metals, Inc.