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COMING NEXT IN SMT MAGAZINE . . .
December 31, 1969 |Estimated reading time: 1 minute
Large-panel Board Printing: Large-panel board applications have rapidly been gaining in popularity. As a result, equipment manufacturers, especially stencil printers, must redesign their equipment to accommodate these larger boards. Because large-board processing is uncharted territory for so many, it is necessary to learn the unique requirements of these boards to product reliable, repeatable applications. This article discusses the issues involved in production printing large-panel circuit boards from the perspective of the solder paste stencil printer manufacturer.
ADHESIVES, COATINGS AND ENCAPSULANTSOrmetOrmet inks are a revolutionary conductive ink technology that can replace plated and etched copper traces on printed circuit boards. The inks are based on recent discoveries in powder metallurgy and polymers that allow the creation of silver-free thick film inks that fire at low temperatures yet achieve stable high electrical conductivity. The inks meet or exceed IPC, Mil Std, and Bellcore specifications for conductive trace durability, adhesion, and environmental stress testing. Ormet inks' conductivity of 1.7 x 10-5 Ohm-cm make them ideal substitutes for etched or plated copper in surface mount technology printed circuit boards. Ormet ink's processing temperature of 200ºC allows the inks to be deposited on common laminated boards. Excellent solderability makes them completely compatible with solder wave, infrared reflow, or hand soldering irons.Toranaga Technologies, Inc., now Ormet Corp