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Soldering Equipment & Materials
December 31, 1969 |Estimated reading time: 7 minutes
Soldering is a critical step in the SMT process. Because high reliability and throughput rates rely on defect-free soldering, it is important that soldering equipment and materials meet the needs of the assembler. Soldering equipment includes ovens and irons, dispensers, and rework and repair equipment. Pastes, fluxes, soldermasks and wires are key soldering materials. SMT presents the following Soldering Equipment & Materials Selector Roundup, spotlighting an assortment of available products.
Soldering SystemLS-100 is designed for selective soldering and rework of all component types, from microBGAs to large QFPs and even odd-shaped and hybrid devices. This system is said to be suitable for soldering and desoldering RF shielding and various paste-in-hole and solder-paste-on-through-hole applications. It is a semiautomatic, off-line rework system that reportedly prevents overheating and thermal stress of components, the board and adjacent components, while enabling the programming of precise reflow profiles. ViTechnology LLC, Haverhill, Mass.
Soldering AdhesiveA one-component, thermosetting, electrically conductive adhesive, CE 3103 is said to be a lead-free solder alternative for SMD interconnect formation. The adhesive reportedly offers ultra-fine-pitch resolution when printed, using either a stainless steel mesh screen or a metal mask stencil. Additionally, the adhesive is syringe-dispensable and may be used with Sn, Sn/Pb and OSP-copper PCB metallizations. Emerson & Cuming Specialty Polymers, a National Starch & Chemical Co., Billerica, Mass.
No-clean Solder PasteDelta 691 no-clean solder paste reportedly provides up to 8" per second print speeds, enhanced stencil life, extended tack time and 72-hour open time. Low post-soldering residues are said to be insulated, soft, clear and print testable. Featuring a wide profile window, the paste reportedly offers a nine-month shelf life and can be reflowed without using nitrogen. Qualitek International Inc., Addison, Ill.
Benchtop Soldering SystemSolderMate MF is said to use a 5-axis automated soldering platform, a combination of micro-flame technology and an 18 x 18 x 3" X, Y, Z work envelope to reportedly create a high-capacity precision system that operates on the benchtop. The system, equipped with automatic flame-out detection, features 360° motion and is controlled by a built-in motion control computer and Windows NT interface. Automation Unlimited Inc., a Div. of MRSI Group, Woburn, Mass.
Water-soluble PasteA water-soluble paste, R560 reportedly reduces voiding in BGA solder connections and prints over a range of environmental conditions. By minimizing voids, the paste is said to produce reliable assemblies. Additionally, it will not break down under high- or low-humidity conditions. Featuring stable stencil and tack life, the paste reportedly exhibits good solderability to various metalizations. Kester Solder, Des Plaines, Ill.
Lead-free Solder PasteA lead-free, no-clean solder paste, CR39 is designed to solder numerous metal finishes without requiring nitrogen during reflow. The paste reportedly leaves a minimal, clear, pale residue after reflow, using a wide thermal profile. Said to be ideal for printing and reflow in air, the paste offers good open time and tack life, extended abandon times, good slump resistance and good soldering activity over a range of reflow profile types. Additionally, it reportedly is suitable for fine-pitch, high-speed stencil printing at rates up to 150 mm per second. Multicore Solders Inc., a Div. of Loctite Corp., Richardson, Texas.
Debridging SystemA system that selectively removes solder bridging from wavesoldered PCBs, SelectX is said to be suited to tight board geometries and ultra-fine-pitch SMT components. Using "tuned" force gas flow technology to reportedly eliminate solder bridges while they are still liquid, the systems displace excess solder, eliminating bridges but not disturbing good solder joints. Because it can be directed to specific areas where bridging is most likely to occur, the system reportedly solves the bridging problem associated with the wavesoldering process. Vitronics Soltec, Portsmouth, N.H.
Solder Paste SeriesNC-SMQ 92 solder paste series is a family of no-clean, halide-free, air-reflowable paste systems reportedly formulated to optimize SMT on high-speed assembly lines. Performing well in open squeegee and chamber printing applications, the materials are said to offer good wetting and probe testability and provide high-speed fine-pitch printing. The series exhibits open times of more than 12 hours, slump resistance and high tack forces. Indium Corp. of America, Utica, N.Y.
Walk-in OvenThe Despatch "S" Series walk-in oven reportedly features a modular design that meets many requirements and shortens delivery time. Available in 34 standard sizes, the oven is ideal for aging, curing, bonding, annealing, drying, backing and heat treating. The oven's temperature uniformity and operating efficiency are said to ensure process reliability and increased yield. Five-inch thick insulated walls reportedly reduce heat loss, while the aluminized steel interior and exterior minimize corrosion. Standard models are available with maximum temperature rates of 500° and 650°C, and sizes range from 360 to 2,200 ft3. Despatch Industries, Minneapolis, Minn.
Spray HeadsProducing a more precise spray pattern, the redesigned Ultra-Spray ultrasonic spray heads of this company's Opti-Flux Series reportedly give better control over flux deposition. The new assembly also is said to make setup and maintenance simpler because thumb screws on the bracket assembly can adjust the position of the liquid applicator and transducer. Ultrasonic Systems Inc., Amesbury, Mass.
Reflow Soldering SystemDesigned to meet the needs of contractors and OEMs faced with large components such as BGAs, SMD sockets and QFPs, Ecosold 350 reportedly prevents problems associated with reflow soldering, such as shadowing and heat sinks. Inside the process chamber, hot air circulates during drying, activation and peak soldering procedures while bottomside heaters reportedly maintain a steady thermoprofile throughout the process. Topside emitters are said to be used sparingly and only in peak zones to prevent temperature drops. Reportedly capable of creating perfect solder joints regardless of solder paste type, the system is designed for PCBs and panels to 13.78 x 19.69". Manncorp, Huntingdon Valley, Pa.
Soldering MachineSaid to offer environmental, safety and health benefits over traditional soldering methods, flameless noncontact induction heating is available in this benchtop machine. System 1 reportedly produces no noxious emissions or volatile gasses. The digitally controlled unit performs in low- to ultra-high temperatures up to 2,000°C and is ideal for brazing/soldering, annealing and curing/bonding applications. Instrumentation includes power adjustments in 1 percent increments from 10 to 100 percent and a timer adjustable in 0.1 second increments from 1.0 to 25.5 seconds. RDO Enterprises, Newark, N.J.
Bar Solder63/37 bar solder has been added to a line of solder pastes, wires, adhesives and related SMT materials to reportedly enable users of both wavesoldering machines and reflow ovens to benefit from product support and development capabilities. The high-purity bar solder is said to be manufactured from virgin metals in a proprietary, atmosphere-controlled process that reduces dross by 12 to 18 percent. Available in 1 lb and 1 kg extruded bars, the solder is said to meet or exceed QQS, MIL, J-STD and ASTM standards requirements. Heraeus Inc., Cermalloy Div., West Conshohocken, Pa.
Ultra-fine-pitch Solder PasteESP ultra-fine-pitch solder paste is said to be formulated for trouble-free application with auger or positive displacement valves in surface mount assembly operations. The paste can be dispensed through tips as fine as 30 gage (0.006" ID) without clogs or separation, reportedly making it possible to assemble 0.015"-pitch PCBAs with automatic dispensing equipment. Its clog-free formulation can provide up to 10,000 shots per hour, for a workflow rate compatible with most pick-and-place machines. Available in several alloys, flux options include RMA, water soluble and no-clean low residue. EFD Inc., Lincoln, R.I.
Batch Soldering OvenAn electrically heated cabinet oven used for soldering parts in fixtures, No. 596 is a modified version of Model HX-650, with extended chamber width and four separate front access doors for leading/unloading the 46 x 20 x 26" workspace. Total installed capacity of 15 kW in tubular heating elements is said to furnish temperatures up to 650°F in the aluminized steel interior. Horizontal air flow across two metal shelves processes the workload. A high/low heat switch reportedly maintains temperature uniformity over the range and throughout the heat chamber. The Grieve Corp., Palatine, Ill.
Epoxy-free FiducialsThese electroformed stencils range in thickness from 0.001 to 0.008", and feature a method of blackening fiducials on electroformed stencils without using an epoxy fill. Traditionally, fiducials have been filled with a black epoxy to enable vision systems to identify location and orientation. The absence of epoxy-filled fiducials, however, eliminates the potential problem of the epoxy popping out, thus increasing the stencil's life. The new method reportedly has proven to be beneficial on electroformed stencils from 0.001 to 0.002" thick. Chepaume Industries, Oriskany, N.Y.
Electroformed StencilsVECOMULTI electroformed stencils reportedly allow users to vary the solder paste amount deposited in different areas of a PCB by varying stencil thickness. As a result, the reject number caused by deposition of the improper amount of paste or material is decreased. The nickel stencils are said to be harder than stainless steel, extending their usable lives by 1.5 to 3 times, and the hardness reportedly reduces damage risk during handling. Available in thicknesses from 100 to 275 µm, the maximum sheet size of 740 x 600 mm suits many printing machines. Stork Veco International Inc., Bedford, Mass.
Solder PasteElectropure solder paste is a homogeneous mixture of pre-alloyed powder, liquid flux and a gelling agent. Each paste formulation is reportedly designed for a specific application type. In the most common manufacturing operations, such as infrared or convection reflow, vapor phase reflow, screening, stenciling, or dispensing, users reportedly experience shorter lead times in startup and less operational down time. AIM, Cranston, R.I.